..., and various components are attached using electrically conductive adhesive (ECA). The impact of sustainable ink and ECA on passive components is analyzed by comparing their performance before and after attachment. Components within an acceptable range of the rated value are in proper functioning order...

.... Typically, thermal interfaces are filled with materials such as thermal adhesives and greases. Interface materials reduce the contact resistance between the mating heat generating and heat sinking units by filling voids and grooves created by the nonsmooth surface topography of the mating surfaces, thus...

...Liu Caroline Chen; Zonghe Lai; Zhaonian Cheng; Johan Liu Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations...

... Persson, K., Lai, Z., Zribi, A., Liu, J., and Willander, M., 1998, “Effect of Bump Height on Flip Chip Joint Reliability Using ACA,” Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology In Electronic Manufacturing, Binghamton, New York, September, pp. 132–136...

...Kiyokazu Yasuda; Jong-Min Kim; Kozo Fujimoto In order to conquer the limitation of conventional solders and adhesives used in electronics packaging, a novel self-organized joining process using conductive adhesive with low melting point alloy was proposed. As a basic characteristic of the adhesive...

...A. Polyakov; M. Bartek; J. N. Burghartz This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5 ± 3.9 J / m 2...

...Z. W. Zhong Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All...

...K. K. Lee; S. C. Tan; Y. C. Chan Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase in heat resistance. Nevertheless, curing process under high temperature...

...X. B. Chen In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding...

... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...

...Andrzej Mościcki; Jan Felba; Tadeusz Sobierajski; Józef Kudzia Pb-free soldering and the use of electrically conducive adhesives in the electronics industry are a segment of the global trend towards a lead-free environment. In comparison to lead-free solders, current commercial isotropic conductive...

... must therefore be controlled by selecting the appropriate mechanical properties of the adhesive film (ACF or NCF) and the build-up substrate material. Moreover, the interconnection reliability during moisture-resistance tests deteriorates because of stress relaxation near the glass-transition...

...G. B. Dou; Y. C. Chan; Johan Liu In anisotropic conductive adhesive (ACA) interconnections, the particles are electrical conductors providing current paths in the fine pitch electronic packaging as well as physical parts connecting with the chip bumps and the substrate pads through the mechanical...

...N. H. Yeung; Y. C. Chan; C. W. Tan Finite element analysis was used to model the transient heat transfer problem and the mechanical influence of the conducting particle in the anisotropic conductive adhesive (ACF). Three-dimensional (3D) brick element was performed for the transient heat transfer...

...C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead...

...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...

...C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead...

...Ryszard Kisiel The aim of current research presented in my paper is to establish how adhesive composition influences the performance of joints between SMDs and PCBs. For identifying the best adhesive formulation in SMT applications, the experiment design method based on Taguchi techniques...

...A. J. Hudson; S. C. Martin; M. Hubert; J. K. Spelt This paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material...

...Johan Liu; Zonghe Lai A reliability study on anisotropically conductive adhesive joints on a Flip-Chip/FR-4 assembly has been carried out. In the study, nine types of anisotropic conductive adhesive (ACA) and one nonconductive film (NCF) were used. In total, nearly one-thousand single joints were...