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Keywords: ball grid array
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
Published Online: January 19, 2021
... factor somehow lead to issue associated with possibility of incomplete filling or void formation. Dot dispense pattern shows less void formation since it produces high-pressure underfill flow within the ball grid array (BGA). This paper provides reliable insight into the industry to choose the best...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
Published Online: October 5, 2004
...Mudasir Ahmad; Ken Hubbard; Mason Hu Ball grid array solder joint reliability is known to be dependent on the shape of solder joints after reflow. To ensure good solder joint formation and prevent solder bridging, it is critical to understand the amount of paste volume needed during assembly...