...M. Y. Tsai; T. C. Kuo This paper aims to demonstrate the biaxial bending strength test on thin silicon dies using the classic ball-on-ring (BoR) test and discuss it in detail by comparing those results with the newly-proposed point load on elastic foundation (PoEF) test. The geometric linear...

...M. Y. Tsai; H. Y. Liu The ball-on-ring (BoR) test, one of the most popular biaxial bending tests, is thoroughly investigated in this study for determining the bending strength of thin silicon dies. The application of this test method with a linear theory to the thin dies is also reevaluated using...

...M. Y. Tsai; H. J. Chen; J. H. Yeh The window glass substrates are commonly used in optical semiconductor and micro-electrical-mechanical system packages. The determination of bending strength of such glass substrates is important for guaranteeing good yield rate and reliability of those packages...

... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...

... strength bending strength scanning electron microscopy Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering material. When components and assemblies soldered with lead-tin alloy become...

... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...