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Keywords: electrical faults
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 391–399.
Published Online: November 28, 2006
... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...
