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Keywords: electronic packaging
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021010.
Paper No: EP-23-1059
Published Online: December 11, 2023
...Tongju Wang; Yahao Liu; Wenqian Zhang; Yongping Lei; Jian Lin; Hanguang Fu; Zipeng Lin Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
Published Online: December 1, 2021
...@usm.my 13 09 2021 25 10 2021 01 12 2021 bump pitch design optimization electronic packaging flip-chip gap height underfill encapsulation Rapid technological advancements drive the micro-electronics sector to focus on both miniaturization and performance aspects...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
Published Online: August 6, 2021
....2014.03.012 [8] Lee , S. , Yim , M. J. , Master , R. N. , Wong , C. P. , and Baldwin , D. F. , 2008 , “ Void Formation Study of Flip Chip in Package Using No-Flow Underfill ,” IEEE Trans. Electron. Packag. Manuf. , 31 ( 4 ), pp. 297 – 305 . 10.1109/TEPM...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
Published Online: September 19, 2019
... rapid prototyping electronic packaging The die-bonding process was carried out by means of a micro-assembly station (Fineplacer lambda, Finetech GmbH). The die was picked by the mechanical arm of the machine and positioned precisely above the designated area on the interposer. An anisotropic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
Published Online: May 24, 2019
..., 2019; published online May 24, 2019. Assoc. Editor: Toru Ikeda. 21 08 2018 22 04 2019 3DPC ceramic substrate aluminosilicate cement shear strength electronic packaging thermal reliability Currently, ceramic substrate has drawn considerable attention in power electronics...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
Published Online: June 11, 2012
... solid-state bonding electronic packaging Si chip Cu substrate At present, nearly all large-scale integrated circuit chips are packaged with flip-chip interconnect technology. The chip is flipped over and the active (front) side is connected to the package using numerous tiny solder joints...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
... interconnect solid-state bonding electronic packaging Si chips Cu substrates At present, nearly all large-scale integrated circuit (IC) chips are packaged with flip-chip technology. This means that the chip is flipped over and the active (front) side is connected to the package using a large number...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
... bonding solid-state bonding process electronic packaging integrated circuits In the flip-chip technology, interconnects are made from the active (front) surface of chips to package substrates. The interconnect joints provide mechanical support, electrical connections, and heat conduction...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
Published Online: January 31, 2008
... of molding compound above the joint, which increased the package compliance. FEA of the electronic packaging assembly is performed with fatigue crack length prediction (and thus package reliability) as the ultimate goal. A FEA model was built to predict the TMF of the BGA assembly. The model geometry...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
Published Online: February 6, 2006
... . Cotterell , B. , Chen , Z. , Han , J. B. , and Tan , N. X. , 2003 , “ The Strength of the Silicon Die in Flip-Chip Assemblies ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.1535934 , 125 , pp. 114 – 119 . McLellan , N. , Fan , N. , Liu , S. , Lau , K...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
... and effectively modeled using the standard implicit time-integration code. 10 05 2004 17 07 2004 printed circuit manufacture electronics packaging bending finite element analysis heat transfer Electronic Packaging Drop Impact Dynamics Finite Element There has been increasing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
... deformation soldering Electronic Packaging Ball Grid Array (BGA) Solder Joints Low Cycle Fatigue Mixed-Mode Loading Since modern electronics technology requires complex, high density, and high-speed devices, the use of surface mount components has been increased. Due to the high degree...