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Keywords: electronic thermal packaging
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
... laminar air flow forced convection electronic thermal packaging One of the most important aspects of electronic equipment management has always been recognized to be the dissipation of the heat produced in the electronic components. As a consequence of the continuous evolution in the electronics...
