... encapsulation filled polymers particle size permittivity sieving silicon compounds thermal conductivity thermal conductivity polymer composite ceramic filler dielectric properties Thermally conductive but electrically insulating, also for their cost effectiveness and design flexibility...

... PACKAGING . Manuscript received Sept. 2001; final revision, March 2002. Associate Editor: A. Y.-H. Hung. 01 Sep 2001 01 March 2002 17 09 2003 thermal conductivity contact resistance filled polymers shear modulus percolation Particle-laden polymeric thermal interface...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...

..., December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 fracture toughness testing notch strength encapsulation plastic packaging integrated circuit packaging finite element analysis filled...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...

...: S. M. Heinrich. 27 July 1999 26 07 2002 flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers Conductive adhesive joining in flip-chip...

... manuscript received January 12, 2001. Associate Editor: G. De Mey. 29 June 1999 12 January 2001 filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture Passive components such as resistors, capacitors...

... of the elastic interaction between the particles and the matrix as well. Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD January 11, 2000. 11 January 2000 silicon compounds filled...

... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...