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Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
...Tae-Wook Kim; Jae-Min Kim; Hyeon-Ji Yun; Jong-Sung Lee; Jae-Hak Lee; Jun-Yeob Song; Young-Chang Joo; Won-Jun Lee; Byoung-Joon Kim Although the reliability of flexible electronics during bending deformation is of great interest nowadays, the mechanical reliability that has mainly been investigated...
View Article titled, Electrical Reliability of <span class="search-highlight">Flexible</span> Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
Open the PDF for Electrical Reliability of <span class="search-highlight">Flexible</span> Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations in another window
Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data