.... Packag. Technol. , 29 ( 4 ), pp. 750 – 757 . 10.1109/TCAPT.2006.885938 [5] Yang , B. , Wang , P. , and Bar-Cohen , A. , 2007 , “ Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices ,” IEEE Trans. Compon. Packag. Technol. , 30 ( 3 ), pp. 432 – 438...

... McKeown. 26 02 2012 07 11 2012 A system of temperature calculations is developed to study the conditions leading to hot spot occurrence on multicore processor chips. The analysis is performed on a physical model which incorporates certain salient features of multicore processor...

... areas, which are called “hot spots”, often occur in silicon chips. For more efficient designs, the temperature and location of hot spots need to be predicted with acceptable accuracy. With millions of transistor gates acting as heat sources, accurate thermal modeling and analysis of silicon chips...