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Keywords: inspection
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041007.
Published Online: November 26, 2012
... ,” ASME J. Electron. Packag. , 131 , p. 011012 . 10.1115/1.3078187 [19] Yang , J. , Zhang , L. , Ume , I. C. , Ghiu , C. , and White , G. , 2010 , “ Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
Published Online: August 1, 2008
...Jin Yang; I. Charles Ume Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
Published Online: April 30, 2004
... near the crack tip can be used as energy release rate at the interface between chip and underfill. Meanwhile, the delamination propagation rates at the interface was measured by using C-mode scanning acoustic microscope (C-SAM) inspection for two types of flip chip packages under thermal cycle loading...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... property to compensate for any placement offsets. However, some problems emerged in practice due to its special features. The major challenges for manufacturer are the inspection of solder joint and to perform touch-up. In most cases, the defect of solder joint cannot be found until in-circuit...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
...Sheng Liu; I. Charles Ume, Mem. ASME Digital signal processing methods in a novel flip chip solder joint quality inspection system are presented. Laser ultrasound and interferometric system is a new approach for solder joint inspection. It has many advantages such as being noncontact...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
... observation, and cross section inspection. The corresponding 3-D finite element simulation was performed to analyze the effects of underfill on thermomechanical behavior. The viscoelasticity of underfill and the viscoplasticity of solder were considered in the 3-D simulations. The Coffin-Manson equation...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 221–226.
Published Online: July 26, 2002
...Sheng Liu; I. Charles Ume A novel approach for flip-chip solder joint quality inspection based on vibration analysis is presented. Traditional solder joint inspection methods have their limitations when applied to flip chips. The vibration detection method is a new approach which has advantages...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
Published Online: July 18, 2000
..., and to reflect completely at the metal surface makes microwave inspection very suitable to detect such delamination. The authors have recently developed a new microwave imaging technique that uses an open-ended coaxial line sensor to detect the delamination in IC packages. The image was created by measuring...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
... and organic substrate under both loading conditions. Shadow Moire´ technique has been used to measure the out-of-plane residual deformation of the FTV that underwent simulated loading conditions. These components were then visually inspected and tested functionally. Results were summarized and used...