... semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High temperature rise or steep temperature gradients within silicon chips often...

... ) swelling coefficient (β) hygrostress input and output (I/O) liquid crystal display (LCD) integrated circuit (IC) finite element analysis (FEA) Anisotropic conductive film (ACF) has been introduced as a promising flip chip interconnection material, due to its potential in achieving high density...