... and are summarized in the following sections. 04 12 2006 30 07 2007 14 02 2008 ball grid arrays ceramics integrated circuit manufacture solders vibrations The low-cycle fatigue failure of solder joints due to coefficient of thermal expansion (CTE) mismatch is fairly well...

... assembling chip scale packaging creep integrated circuit manufacture printed circuits solders Taguchi methods wafer level packaging temperature cyclic loading Taguchi method lead-free solder wafer level chip scale package (WLCSP) Owing to the mismatch of coefficient of thermal...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... the nominal volume of paste to be deposited is kept constant. The second phase consists of developing a model that predicts paste-release efficiencies from small apertures and validating the model with experimental results. 09 02 2004 10 12 2004 assembling soldering integrated circuit...

..., it was found that higher-order elements, such as hexahedra or prisms, are more suitable than tetrahedra. 19 04 2004 02 12 2004 integrated circuit manufacture plastic packaging electronics packaging encapsulation moulding mass production Paddle Shift Mold-Filling Analysis Transfer...

... 01 November 2003 08 07 2004 silicon elemental semiconductors grinding finite element analysis integrated circuit manufacture Until recently, internal-diameter (ID) sawing had been the dominant slicing method for the past three decades 11 12 . Wire sawing, however, is now...

... integrated circuit manufacture electronics packaging classical mechanics The past decade has been marked by a substantial evolution in the proper understanding and modeling of the mechanics of materials at small length scales. The ongoing miniaturization, which has driven the technological...

...; revised manuscript received August 30, 2000. Associate Editor: D. Read. 27 January 1998 30 August 2000 machining brittleness cutting indentation plastic deformation integrated circuit manufacture stochastic processes The development of electronic and photovoltaic industry...