... applications of ECAs in die attach, flip-chip bonding, and chip-on-flex (COF) packaging, highlighting their potential for various electronic devices. microelectronic packaging electrically conductive adhesives isotropic conductive adhesives anisotropic conductive adhesives interconnections...

...-alignment occurs in controlled collapse bonding when the solder interconnects become liquidus and, driven by surface tension, pull the chip into registration with the substrate. To study flip chip self-alignment in the presence of underfill, the viscous forces acting on the chip during realignment...

...Satoru Katsurayama; Hironori Tohmyoh In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the conventional capillary-flow underfill and two no-flow underfill...

... conductivity material. High Density Interconnection is accomplished either by direct printing of 75 micron conductor traces or, for smaller dimensions, conductive ink deposited in specially “patterned” dielectric. (10) The inserted component can itself be a two-sided ceramic circuit with through-hole...

..., with both step-function and sinusoidal temperature histories being considered. The time-dependent effects in the array’s shear deformation are introduced in an approximate manner by modeling the interconnect material (solder) as a temperature-independent linear viscoelastic material. The viscoelastic...

...Naotaka Tanaka, Senior Researcher; Kenya Kawano, Researcher; Hideo Miura, Chief Researcher; Yoshiyuki Kado, Engineer; Ikuo Yoshida, Senior Engineer The interconnection reliability of a contact-joint structure with anisotropic conductive film (ACF) or non-conductive film (NCF) was evaluated in terms...

... and the interconnection as a result of high energy impact on an electronic equipment. Shear test was then performed to examine the change in strength of the ICA joints as a result of impact damage. It was found that the SM ICA joints failed due to impact at a strain rate just over 4000/s. Microstructural examination...

... analysis thermal stress cracking viscoplasticity interconnections The challenging task in today’s fast paced electronics industry is to accurately assess the reliability at a minimal cost and time. Virtual qualification (or “qualification-by-simulation”) can significantly reduce costs...

... on routing. Chapter 5 talks about interconnections and connectors. The writer does a very good job of classifying interconnections as follows: 1 st level chip and lead frame, 2 nd level component leads to PWB, 3 rd level PWBs to each other (i.e. edge connectors or backplanes), 4 th level backpanels...