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Keywords: inverse problems
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Journal Articles

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

Cheng-Hung Huang, Wei-Lun Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011004.
https://doi.org/10.1115/1.4000720
Published Online: March 4, 2010
... in a three-dimensional irregular domain. The advantage of calling CFD − ACE + code as a subroutine in the present inverse calculation lies in that many difficult but practical 3D inverse problem can be solved under this construction since the general-purpose commercial code has the ability to solve...
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Topics: Heat, Inverse problems, Temperature, Heat conduction, Errors
Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 457–464.
https://doi.org/10.1115/1.1827261
Published Online: January 24, 2005
... in Figs. 2 3 . Manuscript received April 26, 2004; revision received April 28, 2004. Review conducted by: B. Sammakia. 26 April 2004 28 April 2004 24 01 2005 chip scale packaging ball grid arrays temperature distribution heat conduction inverse problems finite...
View Article titled, Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods