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Keywords: light interferometry
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
Published Online: November 17, 2008
... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
Published Online: February 13, 2007
... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
Published Online: June 3, 2005
... 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
Published Online: June 10, 2003
... 10 06 2003 chip scale packaging creep shear deformation anelastic relaxation moire fringes light interferometry soldering finite element analysis As electronic systems get smaller in its size (and coherently, lighter in its weight) and faster in its speed, the packages...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
... quality control light interferometry ultrasonic applications spectral analysis data acquisition time-domain analysis signal processing Consumer demands are driving the current trend in the electronics industry to make products that are fast, compact, high density, reliable, and available...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
Published Online: December 12, 2002
.... Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient of thermal expansion (CTE) mismatch between...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 221–226.
Published Online: July 26, 2002
... devices ball grid arrays chip scale packaging soldering inspection modal analysis finite element analysis vibration measurement light interferometry photoacoustic effect measurement by laser beam Solder bump technology has been proven to be a reliable interconnection method in many...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 227–232.
Published Online: December 20, 1999
... devices ball grid arrays plastic packaging rough surfaces light interferometry surface topography measurement thermal stresses environmental testing Fizeau interferometry is a classical interferometry for measuring surface topography of a slightly warped specular (mirror-like) surface (Post...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
Published Online: December 8, 1999
... ball grid arrays displacement measurement calibration finite element analysis light interferometry stress measurement Plastic Ball Grid Array (PBGA) packages are cost-effective surface mounting packages with a high density interconnection, low profiles, and lightweight. They are currently...