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Keywords: microchannel flow
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
Published Online: December 8, 2011
.... Better performance may be achieved by careful optimization of the heat sink’s geometrical parameters and by adapting a new class of hybrid cooling schemes that combine the benefits of microchannel flow with those of jet impingement. Depending on the type of coolant and operating conditions...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
Published Online: September 26, 2011
... microchannel flow micromechanical devices surface chemistry Micropost-filled reactors are commonly found in many micro-total analysis system applications because of their large surface area for the surrounding volume. Optimal fabrication of such devices by increasing the arrays of posts with smaller...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
..., it is found that the effects of variation in substrate material properties are negligible. bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging) conjugate uniform heat flux gas slip flow long microchannel...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
Published Online: March 10, 2011
... Components, Packaging, and Manufacturing Technology Society, and the European Test Technology Technical Committee. The Workshop had participants from 25 countries. cooling electronics packaging heat transfer microchannel flow 10 03 2011 10 03 2011 2011 American Society...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
Published Online: March 2, 2011
...), the error associated with the prediction of heat transfer coefficient using this correlation was larger at 15%; however, this pool boiling correlation still predicted the experimental results better than other empirical correlations developed specifically for microchannel flow boiling. The test loop...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031008.
Published Online: July 2, 2009
... heat transfer mechanism in microchannel flows remains quite illusive. Recent studies in this area point to one of two fundamentally different mechanisms. Commonly cited in the vast majority of recent articles, the first mechanism is described as annular film evaporation evidenced by decreasing value...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031007.
Published Online: June 23, 2009
.... power law fluid microchannels squeezing flow Hele-Shaw thermal interface computational fluid dynamics heat transfer microchannel flow thermal resistance 08 12 2008 15 03 2009 23 06 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
Published Online: April 21, 2009
...Myung Ki Sung; Issam Mudawar This study examines the cooling performance of two hybrid cooling schemes that capitalize on the merits of both microchannel flow and jet impingement to achieve the high cooling fluxes and uniform temperatures demanded by advanced defense electronics. The jets supply...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow Navier-Stokes equations polynomial approximation quadratic programming response surface methodology thermal resistance trapezoidal microchannel electronic cooling...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011015.
Published Online: February 25, 2009
... and memory with RF and other functions). The potential advantages of this technology include better performance, power efficiency, and smaller form factors ( 3 ). ULSI circuit design strategies for 3D integration are also discussed in literature ( 4 5 6 7 ). microchannel flow thermal analysis...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
... three-dimensional microchannel flow passages that are 50 μ m wide and form a honeycomblike structure. Microchannel cooler from Curamik with a DBC substrate The heaters are modeled as circular planar heat sources on top of the DBC copper traces. In order to correlate the measured...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 167–171.
Published Online: February 15, 2007
... response integrated circuit packaging cooling microchannel flow thermal resistance 20 12 2005 15 02 2007 2007 American Society of Mechanical Engineers ...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
... x is normalized to ratio of mean velocity U m to hydraulic diameter D h . 01 11 2005 02 03 2006 laminar flow microchannel flow flow simulation heat transfer dimple microchannel heat transfer enhancement Heat transfer inside flow...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 398–404.
Published Online: February 1, 2006
... 2006 heat sinks electronics packaging flow instability microchannel flow dielectric liquids bubbles heat transfer boiling Flow boiling in microchannels provides very high rates of heat transfer in a compact cooling volume, offering an attractive cooling option for modern...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 412–418.
Published Online: November 23, 2005
.... , 2003 , “ Impingement Air Cooled Plate Fin Heat Sinks ,” M.Eng. thesis, Memorial University of Newfoundland, St. Johns. 17 08 2005 23 11 2005 heat sinks electronics packaging cooling thermal resistance laminar flow microchannel flow impingement flow heat sink thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 294–296.
Published Online: October 11, 2005
... tests ought to be done with water and completely oxidized MHP surfaces, as the contact angle of water on silicon oxide is lower than on silicon. 11 10 2004 11 10 2005 heat pipes microchannel flow thermal conductivity electronics packaging microheat pipe experiment heat...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 1–9.
Published Online: August 10, 2005
... predicts liquid flow in micro-channels, and is therefore a powerful tool for the design and analysis of micro-channel heat sinks intended for electronic cooling. 18 06 2004 10 08 2005 Navier-Stokes equations flow measurement microchannel flow laminar flow vortices cooling pressure...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 30–37.
Published Online: June 17, 2005
... temperature gradients along both coolant and heat sink. Reducing these gradients by increasing the coolant’s flow rate was complicated by the appreciable pressure drop associated with microchannel flow. Bowers and Mudawar ( 2 ) showed how better temperature uniformity can be realized using two-phase...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 38–45.
Published Online: May 25, 2005
... in Heat Transfer , Adademic , New York . computational fluid dynamics heat sinks microchannel flow thermal resistance thermal management (packaging) integrated circuit packaging The performance of microelectronic devices has improved significantly over the past three decades...