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Keywords: microchannel flow
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
Published Online: December 8, 2011
.... Better performance may be achieved by careful optimization of the heat sink’s geometrical parameters and by adapting a new class of hybrid cooling schemes that combine the benefits of microchannel flow with those of jet impingement. ( a ) International thermonuclear experimental reactor (ITER) [( 25...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
Published Online: September 26, 2011
... microchannel flow micromechanical devices surface chemistry Micropost-filled reactors are commonly found in many micro-total analysis system applications because of their large surface area for the surrounding volume. Optimal fabrication of such devices by increasing the arrays of posts with smaller...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
..., it is found that the effects of variation in substrate material properties are negligible. 04 05 2010 18 01 2011 23 06 2011 23 06 2011 bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
Published Online: March 10, 2011
... Components, Packaging, and Manufacturing Technology Society, and the European Test Technology Technical Committee. The Workshop had participants from 25 countries. cooling electronics packaging heat transfer microchannel flow 10 03 2011 10 03 2011 2011 American Society...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
Published Online: March 2, 2011
... ( width   ( μ m ) × depth   ( μ m ) ) on heat transfer coefficients ( 11 ) 24 01 2010 17 05 2010 02 03 2011 02 03 2011 boiling cooling heat sinks microchannel flow microchannel flow boiling confinement effects microchannel dimensions...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031008.
Published Online: July 2, 2009
... ′ is an apparent flow quality. Two different formulations were recommended for apparent quality in subcooled boiling. Levy’s ( 20 ) formulation was attempted but produced unrealistic predictions for microchannel flow. A second formulation by Kroeger and Zuber ( 22 ) was used here. 17 x H ′ ( z...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031007.
Published Online: June 23, 2009
.... power law fluid microchannels squeezing flow Hele-Shaw thermal interface computational fluid dynamics heat transfer microchannel flow thermal resistance 08 12 2008 15 03 2009 23 06 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
Published Online: April 21, 2009
...Myung Ki Sung; Issam Mudawar This study examines the cooling performance of two hybrid cooling schemes that capitalize on the merits of both microchannel flow and jet impingement to achieve the high cooling fluxes and uniform temperatures demanded by advanced defense electronics. The jets supply...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... of variance and regression analysis Order of polynomial R 2 R adj 2 RMSE 2 0.9691 0.9559 1.7 × 10 − 3 12 09 2007 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011015.
Published Online: February 25, 2009
... and memory with RF and other functions). The potential advantages of this technology include better performance, power efficiency, and smaller form factors ( 3 ). ULSI circuit design strategies for 3D integration are also discussed in literature ( 4 5 6 7 ). microchannel flow thermal analysis...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
... three-dimensional microchannel flow passages that are 50 μ m wide and form a honeycomblike structure. Microchannel cooler from Curamik with a DBC substrate The heaters are modeled as circular planar heat sources on top of the DBC copper traces. In order to correlate the measured...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 167–171.
Published Online: February 15, 2007
... from the measured heat-flux values. Good matching of the HTC values resulting from the two different methods was found. 20 12 2005 15 02 2007 transient response integrated circuit packaging cooling microchannel flow thermal resistance The rapid advances in transistor...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
... by the hemispherical protrusion surface case where the efficiency is almost constant. 01 11 2005 02 03 2006 laminar flow microchannel flow flow simulation heat transfer dimple microchannel heat transfer enhancement Moon et al. ( 6 ) consider the effects of the channel height on heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 398–404.
Published Online: February 1, 2006
... 07 2005 01 02 2006 heat sinks electronics packaging flow instability microchannel flow dielectric liquids bubbles heat transfer boiling Flow boiling in microchannels provides very high rates of heat transfer in a compact cooling volume, offering an attractive cooling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 412–418.
Published Online: November 23, 2005
... thermal resistance laminar flow microchannel flow impingement flow heat sink thermal resistance heat transfer The heat dissipated in electronic components is increasing with advances in the performance of modern computers. Furthermore, the structure of these components is becoming ever...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 1–9.
Published Online: August 10, 2005
... predicts liquid flow in micro-channels, and is therefore a powerful tool for the design and analysis of micro-channel heat sinks intended for electronic cooling. 18 06 2004 10 08 2005 Navier-Stokes equations flow measurement microchannel flow laminar flow vortices cooling pressure...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 30–37.
Published Online: June 17, 2005
... in pressure drop. 07 09 2004 17 06 2005 refrigeration thermal management (packaging) integrated circuit packaging microchannel flow cooling heat sinks compressors While thermal management of high-heat-flux electronic devices has attracted significant attention in recent years...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 38–45.
Published Online: May 25, 2005
... such as the number of branches, number of branching levels, and number of channels that reach the center of the disk are addressed in this context. 17 09 2004 25 05 2005 computational fluid dynamics heat sinks microchannel flow thermal resistance thermal management (packaging) integrated...