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Keywords: multilevel modeling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High temperature rise or steep temperature gradients within silicon chips often...
