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Keywords: numerical analysis
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
... density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity analysis time-to-failure It is well known that, as the electronics industry continues to push for high performance...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... than that made from SAC105 no matter on Cu or electroless Ni. Moreover, the fracture was found at the interface between the Cu foil and epoxy in the halogen-free test device. Numerical analysis showed that the thickness of IMC layer dominated the pull strength of the solder joint because the Z-axial...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
Published Online: May 20, 2010
... of up to 135% for the facility with 56% open tiles while the average and maximum changes for the facility with 25% open tiles are 6% and 60%, respectively. 21 04 2009 17 02 2010 20 05 2010 20 05 2010 air conditioning computer centres numerical analysis data center...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
... Δ p ∗ [-] in function of Reynolds number Re: [-] case θ = 0.25 29 07 2008 30 01 2009 31 07 2009 heat conduction heat exchangers numerical analysis heat exchangers extended surfaces Constructal theory computational fluid dynamics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
Published Online: July 31, 2009
... released due to material cracking. direct concentration approach (DCA) moisture diffusion vapor pressure reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
Published Online: February 12, 2009
... Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK 2005, San Francisco, CA, Jul. 17–22 ) has been done, which includes numerical analysis and thermal based optimization of a typical package consisting of a nonuniformly powered die, heat spreader, thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
Published Online: February 11, 2009
... such an index of the first several cycles is followed in the predictions. 23 08 2007 15 04 2008 11 02 2009 ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis An earlier version of this paper was published in Proceedings of IMECE 2007...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
...) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. These methodologies have led to significant improvement in design optimization capabilities, while...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
Published Online: February 12, 2008
..., Version 2.20, Susquehanna University, 2003 . 28 10 2006 25 06 2007 12 02 2008 numerical analysis optoelectronic devices scanning electron microscopes soldering solders surface tension fiber attachment soldering solder joint geometry self-alignment Alignment...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
Published Online: January 19, 2006
... profile with temperature slip at each boundary, as was discussed in previous sections. semiconductor thin films Boltzmann equation ballistic transport thermal conductivity phonon dispersion relations numerical analysis Current microfabrication technologies have allowed...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
Published Online: March 21, 2005
... presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... flow simulation jets optimisation numerical analysis Enhancement of the cooling of electronic modules and packages can be accomplished by a variety of techniques, such as increasing the air flow rate, increasing the surface area through the use of heatsinks, or improving the air flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
Published Online: January 24, 2005
... ventilation natural convection numerical analysis flow simulation The power dissipation density of electronic equipment has increased in recent years and, as a result, it is necessary to consider the cooling design of electronic equipment in order to develop suitable cooling techniques...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
Published Online: January 24, 2005
...-speed experimental data indicates that reduced electrothermal models are an excellent alterative for design methodologies of new generations of IPEMs. modules power electronics electronics packaging reduced order systems heat transfer thermal analysis numerical analysis Integrated Power...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
... October 8, 2003; revision received June 14, 2004. Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 535–540.
Published Online: January 24, 2005
... communication equipment thermal resistance numerical analysis The tremendous increase in the number of users and multimedia and real time applications has led to the congestion of the present networks. As a result, we are witnessing a fast growth in the networks capacity of the TELCO service providers...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
Published Online: January 24, 2005
.... The results indicate good agreement (∼6% discrepancy) between the numerical model and the measurement. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
Published Online: January 24, 2005
... May 2004 05 October 2004 24 01 2005 electronics packaging HVAC heat transfer computational fluid dynamics compressible flow flow simulation turbulence numerical analysis Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
... the fabricated microchannel. silicon compounds alumina microfluidics micromachining channel flow electrophoresis osmosis numerical analysis mixing Recent progress of the surface micromachining technology expands the frontier of engineering applications. Some of them include...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
... for flip chip technology. solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation 01 April 2003 01 November 2003 08 07 2004 Contributed by the Electronic and Photonic Packaging Division for publication...