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Keywords: review
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Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
Published Online: April 29, 2014
... spots, complex fluidic connections, and mechanical design. This paper reviews the advances in 3D IC cooling in the last decade and provides a vision for codesigning 3D IC architecture and integrated cooling systems. For heat fluxes of 50–100 W/cm 2 on each side of a chip in a 3D IC package, the current...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
Published Online: April 29, 2014
... circuit fabrication process and the market demands for devices with high electrical performance, small form factor, low cost etc. This paper reviews the advances of WLP technology in recent years. An overall introduction to WLP is presented in the first part. The fabrication processes of WLP...