... that of ordinary Sn solders. After the shear test, the fractures that occurred in Cu 41 Sn 11 grains were brittle, while the fractures in α (Cu) grains were ductile. e-mail:  xyli@bjut.edu.cn 04 08 2022 23 11 2022 09 12 2022 microstructure evolution solder joint shear strength...

... of the sintered joint was improved due to the microstructural densification. The bonding quality between Cu-F and sintered Ag is enhanced by the Ag-coating treatment. Therefore, the Ag-coated composite joints show higher shear strength than the others. 17 02 2020 27 10 2020 19 01 2021 Cu...

... reactions. Through the comparative analysis of the numerical predictions and the experimental results, the solder layers must completely melt across their thickness and have a total heat over 30 K ms on the Cu to ensure robust interconnections with a shear strength of approximately 37 ± 3 MPa and dense...

... error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic...

...; published online November 12, 2013. Assoc. Editor: Seungbae Park. 27 12 2012 25 09 2013 Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA...

... 2011 adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer...

... has superior physical properties. It has the highest electrical and thermal conductivities among the metals. Scanning electron microscope (SEM) images show that the Ag foil is well bonded to the Au layer on alumina. A standard shear test is performed to determine the shear strength of the bonding...

... testing shear strength solders The transition of most microelectronics products to lead free assembly has led to new challenges even for those industry sectors still exempt from the requirement to change solder alloys. The overall volume of products manufactured by the latter is simply too low...

... as the elastic mismatch. 22 02 2009 18 09 2009 25 02 2010 25 02 2010 delamination mechanical testing shear strength thin films delamination blister test energy release rate phase angle shear effect Thin films have been finding more and more applications in diverse...

... and SnAg solder is reliable. electroplating metallurgy scanning electron microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis SnAg solder bump reliability Flip-chip technology has been applied in interconnecting a large number...

... 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between electric parts. They receive low cycle fatigue damage during on/off switching caused...

... ( ∼ 18 days); have been studied by an analysis using micro-shear testing and nano-indentation techniques. The shear test of the aged bumps showed a slight increase in shear strength after an initial period of aging ( ∼ 50 hours) as compared to the non-aged bumps, but a decrease after longer aging (e.g...

...C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead...

...C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead...

... has been discussed. Also, the fastest possible reflow profile for both the cure of the underfill and maximizing the shear strength is identified. Based on the observed relationship of the mechanical strength and underfill curing of no-flow flip chip assemblies with Q n , the reflow profile should...

... strength is 404 gf, which is many times higher than that (∼50 gf) of the conventional flip chip solder bumps. It is noted that the failure location is in the solder bump (not at the UBM) and the fracture surface is shear dominated, Fig. 7 . 6 Shear strength of WLCSP solder bumps 7 Shear...

...). After the CBGA modules were placed on PCBs, the specimens were divided into two groups, and reflowed in nitrogen and compressed air separately. Properties of the six groups of assemblies, such as shear strength, bending fatigue life, thermal shock cycles, and vibration fatigue life, were tested to find...

... process time is less than 15 seconds during which the actual assembly time is within one second. Most of the samples can pass the shear strength test specified by MIL STD 883D. All the samples could pass 1750 cycles between −55°C and 125°C with slight degradation in die shear strength after the test...