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Keywords: signal processingClose
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
...Sheng Liu; I. Charles Ume, Mem. ASME Digital signal processing methods in a novel flip chip solder joint quality inspection system are presented. Laser ultrasound and interferometric system is a new approach for solder joint inspection. It has many advantages such as being noncontact...