...Rilwan Kayode Apalowo; Mohamad Aizat Abas; Muhamed Abdul Fatah Muhamed Mukhtar; Mohamad Riduwan Ramli This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile...

...Mohamed El Amine Belhadi; Sa'd Hamasha; Ali Alahmer; Xin Wei; Abdallah Alakayleh In realistic applications, the solder joint is continually subjected to thermal-mechanical stress due to the difference in the coefficient of thermal expansion between the printed circuit board substrate...

... of a board level ball grid array chip package and the resonance-based fatigue testing is performed in the FE-based simulation. The global–local modeling approach is utilized to model the test vehicle and the volume average von Mises stress is used to predict the life of the solder joint. Following...

...Xin Wei; Sa'd Hamasha; Ali Alahmer; Mohamed El Amine Belhadi One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of the solder...

...Gangli Yang; Xiaoyan Li; Xu Han; Hu Zhang; Linjie Wen; Shanshan Li The paper focused on the changes in microstructure and mechanical properties of the full Cu 41 Sn 11 solder joint (Cu/Cu 41 Sn 11 /Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn...

... (LTS) alloys have recently received considerable attention because of their low cost and reduced defects in complex assemblies. The shear and fatigue properties of individual solder joints were tested using an Instron micromechanical testing system in this research. Two novel solder alloys (Sn-58Bi...

...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata The larger current densities accompanying increased output of power modules are expected to degrade solder joints by electromigration. Although previous research has experimentally studied electromigration in solder, die...

...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research...

...Tae-Yong Park; Hyun-Ung Oh To overcome the limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However...

...Minghong Jian; Sinan Su; Sa'd Hamasha; Mohammad M. Hamasha; Atif Alkhazali The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical...

...Sinan Su; Francy John Akkara; Ravinder Thaper; Atif Alkhazali; Mohammad Hamasha; Sa'd Hamasha Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since...

... November 22, 2013. Assoc. Editor: Sandeep Tonapi. 16 04 2013 23 10 2013 Intermetallic compounds (IMC) play a key role in the mechanical reliability of solder joints. The present work investigates the diffusion-induced stress developed in the Cu pad/IMC/solder sandwich structure during...

...Tong An; Fei Qin The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop...

... requirements. Land grid array (LGA) package has been becoming popular in portable electronics in terms of low profile on the printed wiring boards and direct Pb-free assembly process compatibility. With the package profile shrinking and operating power increasing, solder joint quality and reliability has...

...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...

...Yi-Shao Lai; Ying-Ta Chiu This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn – 3 Ag – 1.5 Cu ∕ Sn – 3 Ag – 0.5 Cu composite flip-chip solder joints with Ti ∕ Ni ( V ) ∕ Cu under bump metallurgy (UBM), bonded on Au ∕ Ni ∕ Cu substrate pads. The solder joints were...

...Chang-Lin Yeh; Yi-Shao Lai The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles...

...Y. C. Chan; S. H. Fan; J. K. L. Lai In this study, the diffusion behavior and microstructural evolution of Cu-Sn intermetallics at eutectic Sn-Pb solder/copper substrate interface of PBGA solder joints was studied. The PBGA solder joints were formed by different profiles, which was devised to have...

...S. H. Fan; Y. C. Chan; J. K. L. Lai The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same “heating factor” but to have different conveyor speeds. The test results...