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Keywords: thermal management
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
Published Online: February 7, 2022
... inside the motor. In order to improve thermal management, a multiphysics modeling framework that is able to accurately predict the behavior of the motor, while being computationally efficient, is essential. This paper first presents a detailed validation of a lumped parameter thermal network (LPTN) model...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
Published Online: November 5, 2021
.... Government. ASME disclaims all interest in the U.S. Government's contributions. 14 06 2021 04 10 2021 05 11 2021 power electronics SiC phase change material electric vehicle latent heat storage transient thermal management U.S. Army Research Laboratory 10.13039...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
Published Online: October 13, 2021
... ], and the manufacturing of biological products [ 14 ]. In cooling technologies, evaporation is becoming increasingly important as technical advances in micro- and power-electronics exacerbate thermal management challenges. The next generation of high-powered electronics will have heat densities exceeding 1000 W/cm 2...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
Published Online: September 15, 2021
... for an extensive range of thermal-management applications, ranging from aerospace, spacecraft, and smart-building construction materials, to electronics protection, electronics packaging, refrigeration, thermal control during energy harvesting, thermal isolation, etc. A vital factor for tuning the diodicity...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
Published Online: June 29, 2020
... successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
Published Online: June 29, 2020
... mechanisms that are adapted and optimized for the time constants and needs of the specific application. It is the intent of this transient thermal management review to describe a wide range of areas in which transient thermal management for electronics is a factor of significance and to illustrate which...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
Published Online: June 26, 2020
...), combined with a desire to miniaturize, the challenge of removing enough heat from electronic devices in automotive vehicles is evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling method in terms...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
Published Online: May 21, 2020
... Government purposes. 11 01 2020 12 04 2020 21 05 2020 gallium nitride (GaN) high electron mobility transistor (HEMT) power electronics Raman thermometry self-heating thermal dynamics thermal management thermoreflectance thermal imaging wide bandgap (WBG) Wide bandgap...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021009.
Paper No: EP-18-1078
Published Online: March 19, 2020
...Yogesh Fulpagare; Atul Bhargav; Yogendra Joshi With the explosion in digital traffic, the number of data centers as well as demands on each data center, continue to increase. Concomitantly, the cost (and environmental impact) of energy expended in the thermal management of these data centers...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
Published Online: May 8, 2019
... 2019 power electronics thermal management direct bonded copper channels single-phase cooling jet impingement computational fluid dynamics (CFD) Power electronic components are widely used in applications from high voltage electric grid power management to low-voltage battery...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
Published Online: June 1, 2015
... of contained cold aisle systems flow distribution, it is crucial that physics based models of fan curves, server internal resistances, detailed rack models, and other design details are all accurate and experimentally verified. CFD thermal management data center cold aisle containment fan curves...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031010.
Paper No: EP-14-1011
Published Online: May 12, 2014
... Circuits ,” IEEE Trans. Device Mater. Reliab. , 4 ( 4 ), pp. 709 – 714 . 10.1109/TDMR.2004.840160 [2] McGlen , R. J. , Jachuck , R. , and Lin , S. , 2004 , “ Integrated Thermal Management Techniques for High Power Electronic Devices ,” App. Therm. Eng. , 24 ( 8–9 ), pp. 1143 – 1156...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031001.
Paper No: EP-12-1066
Published Online: July 24, 2013
... and reliability challenges for circuit components, multiple levels of interconnections and packaging, and adversely impact overall power efficiencies. Runtime temperature calculations would be beneficial to architectures with dynamic thermal management, which control hotspots by effectively optimizing regional...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
Published Online: March 28, 2013
... January 21, 2013; published online March 28, 2013. Assoc. Editor: Siddharth Bhopte. 13 07 2012 21 01 2013 Currently, the thermal management of microelectromechanical systems (MEMS) has become a challenge. In the present research, a micro pulsating heat pipe (MPHP) with a hydraulic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
Published Online: December 9, 2011
.... The main enabler of 3D integration is through-silicon-vias (TSVs) and stacking of multiple dies. Irrespective of these advantages, thermal management in 3D stacks poses significant challenges for the implementation of 3D integrated circuits. Even though extensive research work has been done...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
...Peipei Li; Jing Liu Thermal management has been a critical issue for the safe running of an electronic device. Driving liquid metal with low melting point to extract heat from the thermal source is highly efficient because of its superior thermophysical properties over conventional coolant...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... microprocessor chips temperature control thermal resistance Data center cooling thermal management chip to cooling tower energy efficiency heat sink © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
Published Online: September 9, 2010
... engineering DP industry gallium alloys liquid metals thermal resistance liquid metal cooling electromagnetic pump high performance CPUs heat transfer enhancement thermal management chip cooling The last five decades have witnessed great prosperity and development of very large scale...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... analysis heat pipes heat sinks semiconductor device packaging heat transfer heat flux centrifugal fan circular stacked heat sink finite element analysis embedded heat pipe diamond copper composite thermal resistance semiconductor chip thermal management A cooling device using...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 360–369.
Published Online: December 13, 2005
...Amip J. Shah; Van P. Carey; Cullen E. Bash; Chandrakant D. Patel Chip power consumption and heat dissipation have become important design issues because of increased energy costs and thermal management limitations. As a global compute utility evolves, seamless connectivity from the chip to the data...