... more than 125 °C. Application of regular Si based Power MOSFETs or insulated gate bipolar transistors (IGBTs) used as switches helps in reducing the overall size of the system and improving efficiency. buck converter type 3 control system SiC device thermal modeling IC design 31 03...

... that the LR formulation is more accurate for transient thermal analysis. 19 07 2010 02 12 2011 21 03 2012 Joule heating transient thermal modeling A major concern in the design of microprocessors is the quality and reliability of on-chip interconnects [( 1...

...Tohru Suwa; Hamid Hadim Although thermal performance is always a critical issue in electronic packaging design at every packaging level, there is a significant lack of reliable and efficient thermal modeling and analysis techniques at the silicon chip level. Sharp temperature increases within small...

... . The illuminance level of each placement design was measured and compared. Both CFD simulation and experimental results are provided to demonstrate the efficacy of the proposed approach for LED array thermal management. light-emitting diode printed circuit board LED array thermal modeling This work...

...Rohit Dev Gupta; Vinayak Eswaran Compact thermal models (CTMs) are simplified multi-nodal thermal resistor network representations of the detailed material and geometric structure of the electronic package. CTMs predict the thermal response of the package, in various environments, to within...