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Keywords: three-dimensional packaging
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Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
Published Online: April 29, 2014
...). wafer level packaging fan-out WLP three-dimensional packaging reliability analysis MEMS review 1 Corresponding author. 2 Present address: Wu Xi Zhong Wei High-Tech Electronics Co., Ltd., Wuxi 214035, China. Contributed by the Electronic and Photonic Packaging Division of ASME...