... areas, which are called “hot spots”, often occur in silicon chips. For more efficient designs, the temperature and location of hot spots need to be predicted with acceptable accuracy. With millions of transistor gates acting as heat sources, accurate thermal modeling and analysis of silicon chips...

...G. De Mey; M. Wójcik; J. Pilarski; M. Lasota; J. Banaszczyk; B. Vermeersch; A. Napieralski; M. De Paepe The thermal impedance Z th ( j ω ) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection...

...Eric Pop; Kenneth E. Goodson As CMOS transistor gate lengths are scaled below 45 nm , thermal device design is becoming an important part of microprocessor engineering. Decreasing dimensions lead to nanometer-scale hot spots in the drain region of the device, which may increase the drain series...