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Keywords: ultrasonic applications
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
... quality control light interferometry ultrasonic applications spectral analysis data acquisition time-domain analysis signal processing Consumer demands are driving the current trend in the electronics industry to make products that are fast, compact, high density, reliable, and available...