..., and density and kinematic viscosity of air. Finally, corresponding correlations are compared with the available two-dimensional studies in literature for infinite parallel plates. At this point, dimensionless parameters should be introduced. Coordinates of the working space, pressure, velocity components...

...) of chip during realignment 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder...

.... This limitation has been previously highlighted (Eveloy, V. et al., 2004, IEEE Trans. Compon., Packag., Technol. 27 , pp. 268–282), with component junction temperature prediction errors of up to 35% reported. This study evaluates the potential of three candidate low-Reynolds number eddy viscosity turbulence...

...Ronald L. Panton, Fellow ASME; Jong W. Lee; Lakhi Goenka; Achyuta Achari This research studies the motion of void bubbles within molten solder bumps. Surface tension variation on the outer surface of the bump drives a flow that is transmitted to the interior by viscosity. Bubbles inside the bump...

... of 0.1 s and ( b ) 1 s. It can be seen that the velocity during decompression is higher when the decompression is done in 0.1 s than in 1 s. Also, the velocity during decompression is higher for packing pressure holding time of 5 s than 20 s. This is because the EMC viscosity is higher at the time...