Conjugate heat transfer from a surface-mounted block (31 × 31 × 7 mm3) to forced convective air flow (1–7 m/s) in a parallel-plate channel was studied experimentally and analytically. Particular attention was directed to the heat flow from the block to the floor through the block support, which was eventually transferred to the air flow over the floor. The concepts of adiabatic wall temperature (Tad) and adiabatic heat transfer coefficient (had) were employed to account for the effect of thermal wake shed from the block on the heat transfer from the floor. The experimental data of Tad and had were used in setting the boundary condition for the numerical analysis of heat conduction in the floor. The accuracy of the numerical predictions of the thermal conductances for different heat flow paths was proven experimentally. The heat conduction analysis code was then used to find the heat transfer capability of various block-support/floor combinations.
Issue Section:
Forced Convection
1.
Anderson
A. M.
1994
, “Decoupling of Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
,” ASME Journal of Electronic Packaging
, Vol. 116
, pp. 310
–316
.2.
Arvizu, D. C., and Moffat, R. J., 1982, “The Use of Superposition in Calculating Cooling Requirements for Circuit Board Mounted Electronic Components,” Electron Components Conference, Vol. 32, pp. 133–134.
3.
Asako
Y.
Faghri
M.
1989
, “Three-Dimensional Heat Transfer Analysis of Arrays of Heated Square Blocks
,” International Journal of Heat and Mass Transfer
, Vol. 32
, No. 2
, pp. 395
–405
.4.
Ashiwake, N., Nakayama, W., Daikoku, T., and Kobayashi, F., 1983, “Forced Convective Heat Transfer From LSI Packages in an Air–Cooled Wiring Board Array,” Heat Transfer in Electronic Equipment—1983, ASME HTD-Vol. 28, pp. 35–42.
5.
Chang, M. J., Shyu, R. J., and Fang, L. J., 1987, “An Experimental Study of Heat Transfer From Surface Mounted Components to a Channel Airflow,” ASME Paper No. 87-HT-75.
6.
Choi
C. Y.
Kim
S. J.
Ortega
A.
1994
, “Effects of Substrate Conductivity on Cooling of Electronic Components
,” ASME Journal of Electronic Packaging
, Vol. 116
, pp. 198
–205
.7.
Chyu
M. K.
Natarajan
V.
1991
, “Local Heat/Mass Transfer Distributions on the Surface of a Wall-Mounted Cube
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 113
, pp. 851
–857
.8.
Culham, J. R., and Yovanovich, M. M., 1987, “Non-iterative Technique for Computing Temperature Distributions in Flat Plates With Distributed Heat Sources and Convective Cooling,” Proc. ASME/JSME Thermal Engineering Joint Conference, Vol. 3, pp. 403–409.
9.
Davalath
J.
Bayazitoglu
Y.
1987
, “Forced Convection Cooling Across Rectangular Blocks
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 109
, pp. 321
–328
.10.
Faghri
M.
Asako
Y.
1992
, “Prediction of Turbulent Three-Dimensional Heat Transfer of Heated Blocks Using Low-Reynolds Number Two-Equation Model
,” Topics in Heat Transfer
, Vol. 1
, ASME HTD-Vol. 206-1, pp. 39
–45
.11.
Farina
D. J.
Hacker
J. M.
Moffat
R. J.
Eaton
J. K.
1994
, “Illuminant Invariant Calibration of Thermochromic Liquid Crystals
,” Experimental Thermal and Fluid Science
, Vol. 9
, No. 1
, pp. 1
–12
.12.
Godfrey
W. M.
Taghavi
K.
Cremers
C. J.
Menguc
M. P.
1990
, “Interactive Thermal Modeling of Electronic Circuit Boards
,” Thermal Modeling and Design of Electronic Systems and Devices
, ASME HTD-Vol. 153
, pp. 65
–71
.13.
Graham, K., and Witzman, S., 1988, “Analytical Correlation of Thermal Design of Electronic Packages,” Cooling Technology for Electronic Equipment, W. Aung, ed., Hemisphere Publishing Corporation, New York, pp. 249–264.
14.
Hollingsworth, D. K., Boehman, A. L., Smith, E. G., and Moffat, R. J., 1989, “Measurement of Temperature and Heat Transfer Coefficient Distributions in a Complex Flow Using Liquid Crystal Thermography and True-Color Image Processing,” Collected Papers in Heat Transfer 1989, ASME HTD-Vol. 123, pp. 35–42.
15.
Igarashi
T.
Takasaki
H.
1990
, “Enhancement of Heat Transfer Around a Rectangular Cylinder in a Flat Plate Boundary Layer
,” Transactions of the Japan Society of Mechanical Engineers
, Vol. 56
, No. 531
, pp. 227
–234
.16.
Incropera, F. P., and De Witt, D. P., 1981, Fundamentals of Heat and Mass Transfer, Wiley, New York, pp. 399–400.
17.
Incropera
F. P.
Kerby
J. S.
Moffatt
D. F.
Ramadhyani
S.
1986
, “Convection Heat Transfer From Discrete Heat Sources in a Rectangular Channel
,” International Journal of Heat and Mass Transfer
, Vol. 29
, pp. 1051
–1058
.18.
Kang
B. H.
Jaluria
Y.
1989
, “Mixed Convection Transport From a Protruding Heat Source Module on a Vertical Surface
,” AIAA Journal of Thermophysics
, Vol. 4
, pp. 384
–390
.19.
Kang
B. H.
Jaluria
Y.
Tewari
S. S.
1990
, “Mixed Convection Transport From an Isolated Heat Source Module on a Horizontal Plate
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 112
, pp. 653
–661
.20.
Kim
S. H.
Anand
A. K.
1994
a, “Laminar Developing Flow and Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources
,” International Journal of Heat and Mass Transfer
, Vol. 37
, pp. 2231
–2244
.21.
Kim
S. H.
Anand
A. K.
1994
b, “Turbulent Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 116
, pp. 577
–587
.22.
Kim
S. H.
Sung
H. J.
Hyun
J. M.
1994
, “Mixed Convection From Multiple-Layered Boards With Cross-Streamwise Periodic Boundary Conditions
,” International Journal of Heat and Mass Transfer
, Vol. 35
, pp. 2941
–2952
.23.
Kim
S. H.
Anand
A. K.
1995
, “Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources
,” ASME Journal of Electronic Packaging
, Vol. 117
, pp. 52
–62
.24.
Lall, B. S., Ortega, A., and Kabir, H., 1994, “Thermal Design Rules for Electronic Components on Conducting Boards in Passively Cooled Enclosures,” Proc. Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM IV), Washington, DC, pp. 50–61.
25.
Moffat, R. J., and Ortega, A., 1988, “Direct Air–Cooling of Electronic Components,” Advances in Thermal Modeling of Electronic Components and Systems, A. Bar-Cohen and A. D. Kraus, eds., Hemisphere Publishing Corporation, New York, Vol. 1, Chap. 3, pp. 129–282.
26.
Nakayama, W., Matsushima, H., and Goel, P., 1988, “Forced Convective Heat Transfer From Arrays of Finned Packages,” Cooling Technology for Electronic Equipment, W. Aung, ed., Hemisphere Publishing Corporation, New York, pp. 195–210.
27.
Nigen
J. S.
Amon
C. H.
1994
, “Time-Dependent Conjugate Heat Transfer Characteristics of Self-Sustained Oscillatory Flows in a Grooved Channel
,” ASME Journal of Fluids Engineering
, Vol. 116
, pp. 499
–507
.28.
Ortega, A., Ramanathan, S., Chicci, J. D., and Prince, J. L., 1993, “Thermal Wake Models for Forced Air Cooling of Electronic Components,” Proc. 9th IEEE SEMI-THERM Symposium, pp. 63–74.
29.
Ortega
A.
Wirth
U. S.
Kim
S. J.
1994
, “Conjugate Forced Convection From a Discrete Heat Source on a Plane Conducting Surface: A Benchmark Experiment
,” Heat Transfer in Electronic Systems
, ASME HTD-Vol. 292
, pp. 25
–36
.30.
Ramadhyani
S.
Moffatt
D. F.
Incropera
F. P.
1985
, “Conjugate Heat Transfer From Small Isothermal Heat Sources Embedded in a Large Substrate
,” International Journal of Heat and Mass Transfer
, Vol. 28
, pp. 1945
–1952
.31.
Roeller
P. T.
Stevens
J.
Webb
B. W.
1991
, “Heat Transfer and Turbulent Flow Characteristics of Isolated Three-Dimensional Protrusions in Channels
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 113
, pp. 597
–603
.32.
Rosten, H. I., and Viswanath, R., 1994, “Thermal Modeling of the Pentium™ Processor Package,” presented at the IEEE Electronic Component Technology Conference (ECTC), Washington, DC, May.
33.
Shaw
H.-J.
Chen
W.-L.
Chen
C.-K.
1991
, “Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source
,” ASME Journal of Electronic Packaging
, Vol. 113
, pp. 40
–49
.34.
Sridhar
S.
Faghri
M.
Lessmann
R. C.
Schmidt
R.
1990
, “Heat Transfer Behavior Including Thermal Wake Effects in Forced Air Cooling of Arrays of Rectangular Blocks
,” Thermal Modeling and Design of Electronic Systems and Devices
, ASME HTD-Vol. 153
, pp. 15
–26
.35.
Sugavanam, R., Ortega, A., and Choi, C. Y., 1994, “A Numerical Investigation of Conjugate Heat Transfer From a Flush Heat Source on a Conductive Board in Laminar Channel Flow,” Proc. Intersociety Conference on Thermal Phenomena in Electronic Systems (1-THERM IV), Washington, DC, pp. 62–72.
36.
Webb
B. W.
Ramadhyani
S.
1985
, “Conjugate Heat Transfer in a Channel With Staggered Ribs
,” International Journal of Heat and Mass Transfer
, Vol. 28
, pp. 1679
–1687
.37.
Wirtz, R. A., and Dykshoorn, P., 1984, “Heat Transfer From Arrays of Flat Packs in a Channel Flow,” Proc. 4th International Electronic Packaging Conference, pp. 318–326.
38.
Zebib
A.
Wo
Y. K.
1989
, “A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device
,” ASME Journal of Electronic Packaging
, Vol. 111
, pp. 41
–45
.
This content is only available via PDF.
Copyright © 1996
by The American Society of Mechanical Engineers
You do not currently have access to this content.
