An autonomous thermal control system has been developed for instruments with steady temperature requirements that are exposed to widely varying environmental conditions. The active thermal control system uses thermo-electric (Peltier) coolers with a programmable power supply, digital temperature sensors, and on-board proportional differential logic to track and predict temperature variations. This system is designed for instruments with large thermal mass and thermally sensitive electronic components that would be effected by variabilities in the local outdoor environment including weather, sunrise, and sunset. Presented are the test results of the design showing the temperature stayed within ±0.125°C during smooth ambient temperature changes (27°C ambient change over 80 min), remained within +0.375/0.6875°C under a sharp ambient temperature drop (27°C sudden drop), and remained within +0.25/0.875°C when random variabilities in the ambient were introduced (210°Cdegree variabilities over the time frame of minutes). For the thermal control system and test results presented, it is shown that several calibration and design points must be considered for a large thermal mass system in order to achieve steady thermal control. The system presented is capable of maintaining steady thermal control within the given constraints.

1.
Li
,
D.
,
Huxtable
,
S. T.
,
Abramson
,
A. R.
, and
Majumdar
,
A.
, 2005, “
Thermal Transport in Nanostructured Solid-State Cooling Devices
,”
ASME J. Heat Transfer
0022-1481,
127
, pp.
108
114
.
2.
Dziurdzia
,
P.
, and
Kos
,
A.
, 2000, “
High Efficiency Active Cooling System
,”
Semiconductor Thermal Measurement and Management Symposium, 16th Annual IEEE SEMI-THERM Symposium
, pp.
19
26
.
3.
Wan
,
J. W.
,
Zhang
,
W. J.
,
Torvi
,
D.
, and
Wu
,
F. X.
, 2004, “
An Analysis to Two-Heater Active Thermal Control Technology for Device Class Testing
,”
IEEE Trans. Compon. Packag. Technol.
,
27
(
3
), pp.
577
584
. 1521-3331
4.
McCarty
,
R.
,
Hallinan
,
K. P.
,
Sanders
,
B.
, and
Somphone
,
T.
, 2007, “
Enhancing Thermoelectic Energy Recovery via Modulations of Source Temperature for Cyclical Heat Loading
,”
ASME J. Heat Transfer
0022-1481,
129
(
6
), pp.
749
755
.
5.
Simons
,
R. E.
,
Ellsworth
,
M. J.
, and
Chu
,
R. C.
, 2005, “
An Assessment of Module Cooling Enhancement With Thermoelectric Coolers
,”
ASME J. Heat Transfer
0022-1481,
127
(
1
), pp.
76
84
.
6.
Riffat
,
S. B.
, and
Ma
,
X.
, 2003, “
Thermoelectrics: A Review of Present and Potential Applications
,”
Appl. Therm. Eng.
1359-4311,
23
, pp.
913
935
.
7.
Chein
,
R.
, and
Huang
,
G.
, 2004, “
Thermoelectric Cooler Application in Electronic Cooling
,”
Appl. Therm. Eng.
1359-4311,
24
, pp.
2207
2217
.
10.
Huang
,
B. J.
,
Chun
,
C. J.
, and
Duang
,
C. L.
, 2000, “
A Design Method of Thermoelectric Cooler
,”
Int. J. Refrig.
0140-7007,
23
, pp.
208
218
.
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