Collisional heat transfer between two contacting curved surfaces is investigated computationally using a finite difference method and analytically using various asymptotic methods. Transformed coordinates that scale with the contact radius and the diffusion length are used for the computations. Hertzian contact theory of elasticity is used to characterize the contact area as a function of time. For an axisymmetric contact area, a two-dimensional self-similar solution for the thermal field during the initial period of contact is obtained, and it serves as an initial condition for the heat transfer simulation throughout the entire duration of collision. A two-dimensional asymptotic heat transfer result is obtained for small Fourier number. For finite Fourier numbers, local analytical solutions are presented to elucidate the nature of the singularity of the thermal field and heat flux near the contact point. From the computationally determined heat transfer during the collision, a closed-form formula is developed to predict the heat transfer as a function of the Fourier number, the thermal diffusivity ratio, and the thermal conductivity ratio of the impacting particles.
Skip Nav Destination
e-mail: likelichina@ufl.edu
e-mail: rwmei@ufl.edu
e-mail: klaus@ufl.edu
e-mail: dwhahn@ufl.edu
Article navigation
Research Papers
Heat Transfer Between Colliding Surfaces and Particles
Like Li,
Like Li
Department of Mechanical and Aerospace Engineering,
e-mail: likelichina@ufl.edu
University of Florida
, Gainesville, FL 32611
Search for other works by this author on:
Renwei Mei,
Renwei Mei
Professor
Department of Mechanical and Aerospace Engineering,
e-mail: rwmei@ufl.edu
University of Florida
, Gainesville, FL 32611
Search for other works by this author on:
James F. Klausner,
James F. Klausner
Professor
Department of Mechanical and Aerospace Engineering,
e-mail: klaus@ufl.edu
University of Florida
, Gainesville, FL 32611
Search for other works by this author on:
David W. Hahn
David W. Hahn
Professor
Department of Mechanical and Aerospace Engineering,
e-mail: dwhahn@ufl.edu
University of Florida
, Gainesville, FL 32611
Search for other works by this author on:
Like Li
Department of Mechanical and Aerospace Engineering,
University of Florida
, Gainesville, FL 32611e-mail: likelichina@ufl.edu
Renwei Mei
Professor
Department of Mechanical and Aerospace Engineering,
University of Florida
, Gainesville, FL 32611e-mail: rwmei@ufl.edu
James F. Klausner
Professor
Department of Mechanical and Aerospace Engineering,
University of Florida
, Gainesville, FL 32611e-mail: klaus@ufl.edu
David W. Hahn
Professor
Department of Mechanical and Aerospace Engineering,
University of Florida
, Gainesville, FL 32611e-mail: dwhahn@ufl.edu
J. Heat Transfer. Jan 2012, 134(1): 011301 (12 pages)
Published Online: November 18, 2011
Article history
Received:
December 1, 2010
Revised:
August 8, 2011
Online:
November 18, 2011
Published:
November 18, 2011
Citation
Li, L., Mei, R., Klausner, J. F., and Hahn, D. W. (November 18, 2011). "Heat Transfer Between Colliding Surfaces and Particles." ASME. J. Heat Transfer. January 2012; 134(1): 011301. https://doi.org/10.1115/1.4004874
Download citation file:
Get Email Alerts
Cited By
Estimation of thermal emission from mixture of CO2 and H2O gases and fly-ash particles
J. Heat Mass Transfer
Non-Classical Heat Transfer and Recent Progress
J. Heat Mass Transfer
Related Articles
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
J. Heat Transfer (April,2002)
Numerical
Simulation of Transient Thermal Transport on a Rotating Disk Under Partially Confined Laminar Liquid
Jet Impingement
J. Heat Transfer (May,2010)
Utilization of Advanced Working Fluids With Biporous Evaporators
J. Thermal Sci. Eng. Appl (June,2011)
Comparison Between Thermal Conductivity Models on Heat Transfer in Power-Law Non-Newtonian Fluids
J. Heat Transfer (April,2012)
Related Proceedings Papers
Related Chapters
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition
Liquid Cooled Systems
Thermal Management of Telecommunications Equipment
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment