In this article, two models for phonon transmission across semiconductor interfaces are investigated and demonstrated in the context of large-scale spatially three-dimensional calculations of the phonon Boltzmann transport equation (BTE). These include two modified forms of the classical diffuse mismatch model (DMM): one, in which dispersion is accounted for and another, in which energy transfer between longitudinal acoustic (LA) and transverse acoustic (TA) phonons is disallowed. As opposed to the vast majority of the previous studies in which the interface is treated in isolation, and the thermal boundary conductance is calculated using closed-form analytical formulations, the present study also considers the interplay between the interface and intrinsic (volumetric) scattering of phonons. This is accomplished by incorporating the interface models into a parallel solver for the full seven-dimensional BTE for phonons. A verification study is conducted in which the thermal boundary resistance of a silicon/germanium interface is compared against the previously reported results of molecular dynamics (MD) calculations. The BTE solutions overpredicted the interfacial resistance, and the reasons for this discrepancy are discussed. It is found that due to the interplay between intrinsic and interface scattering, the interfacial thermal resistance across a Si(hot)/Ge(cold) bilayer is different from that of a Si(cold)/Ge(hot) bilayer. Finally, the phonon BTE is solved for a nanoscale three-dimensional heterostructure, comprised of multiple blocks of silicon and germanium, and the time evolution of the temperature distribution is predicted and compared against predictions using the Fourier law of heat conduction.
Skip Nav Destination
Article navigation
Research-Article
Phonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport Equation
Syed Ashraf Ali,
Syed Ashraf Ali
Department of Mechanical and
Aerospace Engineering,
Aerospace Engineering,
The Ohio State University
,Columbus, OH 43210
Search for other works by this author on:
Sandip Mazumder
Sandip Mazumder
1
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
e-mail: mazumder.2@osu.edu
Department of Mechanical and
Aerospace Engineering,
The Ohio State University
,Columbus, OH 43210
e-mail: mazumder.2@osu.edu
1Corresponding author.
Search for other works by this author on:
Syed Ashraf Ali
Department of Mechanical and
Aerospace Engineering,
Aerospace Engineering,
The Ohio State University
,Columbus, OH 43210
Sandip Mazumder
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
e-mail: mazumder.2@osu.edu
Department of Mechanical and
Aerospace Engineering,
The Ohio State University
,Columbus, OH 43210
e-mail: mazumder.2@osu.edu
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received January 6, 2015; final manuscript received April 24, 2015; published online June 2, 2015. Assoc. Editor: Laurent Pilon.
J. Heat Transfer. Oct 2015, 137(10): 102401 (11 pages)
Published Online: October 1, 2015
Article history
Received:
January 6, 2015
Revision Received:
April 24, 2015
Online:
June 2, 2015
Citation
Ali, S. A., and Mazumder, S. (October 1, 2015). "Phonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport Equation." ASME. J. Heat Transfer. October 2015; 137(10): 102401. https://doi.org/10.1115/1.4030565
Download citation file:
Get Email Alerts
Cited By
Enhancing Thermal Transport in Polymeric Composites Via Engineered Noncovalent Filler–Polymer Interactions
J. Heat Mass Transfer (March 2025)
Turbulent Flow and Heat Transfer Characteristics of Novel Vortex Ribs in a Rotating Channel
J. Heat Mass Transfer (June 2025)
Related Articles
Thermal Wave Based on the Thermomass Model
J. Heat Transfer (July,2010)
Simulation of Interfacial Phonon Transport in Si–Ge Heterostructures Using an Atomistic Green’s Function Method
J. Heat Transfer (April,2007)
Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
J. Heat Transfer (February,2001)
Cross-Plane Phonon Conduction in Polycrystalline Silicon Films
J. Heat Transfer (July,2015)
Related Proceedings Papers
Related Chapters
What Have We Learned About Uncertainty? Are We Still Playing with Fire
Uncertainty in Fire Standards and What to Do About It
The Future of Silicon X-Ray Detectors
Energy Dispersion X-Ray Analysis: X-Ray and Electron Probe Analysis
Structure-Sensitive Properties of Materials Disclosed by a Combination of X-Ray Topography X-Ray Diffraction Analysis, and Electron Microscopy Methods
Metallography—A Practical Tool for Correlating the Structure and Properties of Materials