In this paper, a 3D-conjugated heat transfer model for nano-encapsulated phase change materials (NEPCMs) cooled micro pin fin heat sink (MPFHS) is presented. The governing equations of flow and heat transfer are solved using a finite volume method based on collocated grid and the results are validated with the available data reported in the literature. The effect of nanoparticles volume fraction (C = 0.1, 0.2, and 0.3), inlet velocity (Vin = 0.015, 0.030, and 0.045 m/s), and bottom wall temperature (Twall = 299.15, 303.15, 315.15, and 350.15 K) is studied on Nusselt and Euler numbers as well as temperature contours in the system. The results indicate that significant heat transfer enhancement is achieved when using the NEPCM slurry as an advanced coolant. The maximum Nusselt number when NEPCM slurry (C = 0.3) with Vin = 0.015, 0.030, and 0.045 (m/s) is employed is 2.27, 1.81, and 1.56 times higher than the ones with base fluid, respectively. However, with increasing bottom wall temperature, the Nusselt number first increases then decreases. The former is due to higher heat transfer capability of coolant at temperatures over the melting range of phase change material (PCM) particles due to partial melting of nanoparticles in this range. However, the latter phenomenon is due to the lower capability of the NEPCM particles and consequently coolant in absorbing heat at coolant temperatures is higher than the temperature correspond to fully melted NEPCM. It was observed that the NEPCM slurry has a drastic effect on the Euler number, and with increasing volume fraction and decreasing inlet velocity, the Euler number increases accordingly.
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Flow and Heat Transfer in Micro Pin Fin Heat Sinks With Nano-Encapsulated Phase Change Materials
Bahram Rajabifar,
Bahram Rajabifar
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
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Hamid Reza Seyf,
Hamid Reza Seyf
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Search for other works by this author on:
Yuwen Zhang,
Yuwen Zhang
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: zhangyu@missouri.edu
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: zhangyu@missouri.edu
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Sanjeev K. Khanna
Sanjeev K. Khanna
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Search for other works by this author on:
Bahram Rajabifar
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Hamid Reza Seyf
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Yuwen Zhang
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: zhangyu@missouri.edu
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: zhangyu@missouri.edu
Sanjeev K. Khanna
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received January 23, 2014; final manuscript received February 11, 2016; published online March 22, 2016. Editor: Portonovo S. Ayyaswamy.
J. Heat Transfer. Jun 2016, 138(6): 062401 (8 pages)
Published Online: March 22, 2016
Article history
Received:
January 23, 2014
Revised:
February 11, 2016
Citation
Rajabifar, B., Seyf, H. R., Zhang, Y., and Khanna, S. K. (March 22, 2016). "Flow and Heat Transfer in Micro Pin Fin Heat Sinks With Nano-Encapsulated Phase Change Materials." ASME. J. Heat Transfer. June 2016; 138(6): 062401. https://doi.org/10.1115/1.4032834
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