The influence of airflow shear on the free surface deformation and the flow structure for large Prandtl number fluid (Pr = 111.67) has been analyzed numerically as the parallel airflow shear is induced into the surrounding of liquid bridge from the lower disk or the upper disk. Contrasted with former studies, an improved level set method is adopted to track any tiny deformation of free surface, where the area compensation is carried out to compensate the nonconservation of mass. Present results indicate that the airflow shear can excite flow cells in the isothermal liquid bridge. The airflow shear induced from the upper disk impulses the convex region of free interface as the airflow shear intensity is increased, which may exceed the breaking limit of liquid bridge. The free surface is transformed from the “S”-shape into the “M”-shape as the airflow shear is induced from the lower disk. For the nonisothermal liquid bridge, the flow cell is dominated by the thermocapillary convection at the hot corner if the airflow shear comes from the hot disk, and another reversed flow cell near the cold disk appears. While the shape of free surface depends on the competition between the thermocapillary force and the shear force when the airflow is induced from the cold disk.
Skip Nav Destination
Article navigation
December 2017
This article was originally published in
Journal of Heat Transfer
Research-Article
Influence of Ambient Airflow on Free Surface Deformation and Flow Pattern Inside Liquid Bridge With Large Prandtl Number Fluid (Pr > 100) Under Gravity
Shuo Yang,
Shuo Yang
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
School of Horticulture,
Shenyang Agricultural University,
Shenyang 110866, China
Shenyang Agricultural University,
Shenyang 110866, China
Search for other works by this author on:
Ruquan Liang,
Ruquan Liang
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
School of Mechanical and Vehicle Engineering,
Linyi University,
Linyi 276005, China
e-mail: liang@epm.neu.edu.cn
Linyi University,
Linyi 276005, China
e-mail: liang@epm.neu.edu.cn
Search for other works by this author on:
Song Xiao,
Song Xiao
School of Mechanical and Vehicle Engineering,
Linyi University,
Linyi 276005, China
Linyi University,
Linyi 276005, China
Search for other works by this author on:
Jicheng He,
Jicheng He
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
Search for other works by this author on:
Shuo Zhang
Shuo Zhang
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
Search for other works by this author on:
Shuo Yang
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
School of Horticulture,
Shenyang Agricultural University,
Shenyang 110866, China
Shenyang Agricultural University,
Shenyang 110866, China
Ruquan Liang
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China;
School of Mechanical and Vehicle Engineering,
Linyi University,
Linyi 276005, China
e-mail: liang@epm.neu.edu.cn
Linyi University,
Linyi 276005, China
e-mail: liang@epm.neu.edu.cn
Song Xiao
School of Mechanical and Vehicle Engineering,
Linyi University,
Linyi 276005, China
Linyi University,
Linyi 276005, China
Jicheng He
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
Shuo Zhang
Key Laboratory of National Education Ministry
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
for Electromagnetic Process of Materials,
Northeastern University,
Shenyang 110819, China
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received September 7, 2016; final manuscript received May 17, 2017; published online June 27, 2017. Assoc. Editor: Guihua Tang.
J. Heat Transfer. Dec 2017, 139(12): 122001 (10 pages)
Published Online: June 27, 2017
Article history
Received:
September 7, 2016
Revised:
May 17, 2017
Citation
Yang, S., Liang, R., Xiao, S., He, J., and Zhang, S. (June 27, 2017). "Influence of Ambient Airflow on Free Surface Deformation and Flow Pattern Inside Liquid Bridge With Large Prandtl Number Fluid (Pr > 100) Under Gravity." ASME. J. Heat Transfer. December 2017; 139(12): 122001. https://doi.org/10.1115/1.4036871
Download citation file:
Get Email Alerts
Cited By
Challenges and Innovations of Lithium-Ion Battery Thermal Management Under Extreme Conditions: A Review
J. Heat Mass Transfer (August 2023)
Related Articles
Numerical Analysis of Conjugated Convection-Conduction Heat Transfer in a Microtube Gas Flow
J. Thermal Sci. Eng. Appl (February,2019)
Foreword to Special Issue on Micro/Nanoscale Heat and Mass Transfer—Part II
J. Heat Transfer (January,2018)
Foreword to Special Issue on Micro/Nanoscale Heat and Mass Transfer—Part I
J. Heat Transfer (May,2017)
Imaging Thermal Transport in Graphene
J. Heat Transfer (February,2015)
Related Proceedings Papers
Related Chapters
Extended Surfaces
Thermal Management of Microelectronic Equipment
Extended Surfaces
Thermal Management of Microelectronic Equipment, Second Edition
Radiation
Thermal Management of Microelectronic Equipment