Performance of a new compact cooling unit for semiconductors, being composed of an atomizer, a fan, and a heat-dissipating surface with no fin, has been measured over a wide range of the mass flow rate of spray water, m˙, and the wall heat flux. The heat transfer performance of the present compact, unit with m˙ = 0 to 1.05 g/s, attains 1.8 to 20 times that of the parallel-plate channel under the same thermal conditions.
Issue Section:
Research Papers
Topics:
Cooling,
Flow (Dynamics),
Water,
Heat,
Heat flux,
Heat transfer,
Semiconductors (Materials),
Sprays
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Copyright © 1983
by ASME
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