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Journal Articles

Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”

Jingjie Zhang, Carlos A. Polanco, Avik W. Ghosh

Publisher: ASME

J. Heat Mass Transfer. September 2018, 140(9): 092405.

Paper No: HT-17-1399

https://doi.org/10.1115/1.4040144

Published Online: May 25, 2018

View Article titled, Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”

Topics: Bonding, Electrical conductance, Junctions, Thermal conductivity, Chain, Simulation, Phonons, Density, Stiffness, Atoms

Journal Articles

Heat Transfer Across Nanoparticle–Liquid Interfaces

Anjan R. Nair, Sarith P. Sathian

Publisher: ASME

J. Heat Mass Transfer. November 2016, 138(11): 112402.

Paper No: HT-15-1112

https://doi.org/10.1115/1.4033954

Published Online: July 19, 2016

View Article titled, Heat Transfer Across Nanoparticle–Liquid Interfaces

Topics: Fluids, Heat transfer, Nanoparticles, Particulate matter, Temperature, Particle size, Simulation, Heat, Electrical conductance, Bonding

Journal Articles

Investigation on Carbon Nanotubes as Thermal Interface Material Bonded With Liquid Metal Alloy

Yulong Ji, Gen Li, Chao Chang, Yuqing Sun, Hongbin Ma

Publisher: ASME

J. Heat Mass Transfer. September 2015, 137(9): 091017.

Paper No: HT-14-1261

https://doi.org/10.1115/1.4030233

Published Online: May 14, 2015

View Article titled, Investigation on Carbon Nanotubes as Thermal Interface Material Bonded With Liquid Metal Alloy

Topics: Carbon nanotubes, Lasers, Plasmas (Ionized gases), Temperature, Thermal resistance, Thermal diffusivity, Thermal conductivity, Copper, Bonding, Heat transfer

Journal Articles

Fabrication and Experimental Characterization of Nanochannels

Vinh-Nguyen Phan, Nam-Trung Nguyen, Chun Yang, Pierre Joseph, Anne-Marie Gué

Publisher: ASME

J. Heat Mass Transfer. May 2012, 134(5): 051012.

https://doi.org/10.1115/1.4005702

Published Online: April 13, 2012

View Article titled, Fabrication and Experimental Characterization of Nanochannels

Topics: Drying, Glass, Manufacturing, Nanofluidics, Reactive-ion etching, Silicon, Microchannels, Semiconductor wafers, Etching, Experimental characterization

Journal Articles

Thermal Processing of Tissue Engineering Scaffolds

Alisa Morss Clyne

Publisher: ASME

J. Heat Mass Transfer. March 2011, 133(3): 034001.

https://doi.org/10.1115/1.4002464

Published Online: November 16, 2010

View Article titled, Thermal Processing of Tissue Engineering Scaffolds

Topics: Bonding, Casting, Drying, Electrospinning, Emulsions, Fibers, High pressure (Physics), Particulate matter, Phase separation, Polymers

Journal Articles

Equivalent Thermal Resistance of a Corrugated Contact Boundary

C. Y. Wang, Mem. ASME,

Publisher: ASME

J. Heat Mass Transfer. May 2000, 122(2): 365–367.

https://doi.org/10.1115/1.521472

Published Online: November 15, 1999

View Article titled, Equivalent Thermal Resistance of a Corrugated Contact Boundary

Topics: Bonding, Contact resistance, Heat conduction, Thermal resistance, Heat transfer, Adhesion, Perturbation theory

Journal Articles

Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

C. H. Amon, K. S. Schmaltz, R. Merz, F. B. Prinz

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 164–172.

https://doi.org/10.1115/1.2824030

Published Online: February 1, 1996

View Article titled, Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

Topics: Bonding, Drops, Manufacturing, Metals, Computer simulation, Temperature, Cooling, Heat transfer, Solidification, Analytical methods

Journal Articles

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

K. Ramakrishna, I. M. Cohen, P. S. Ayyaswamy

Publisher: ASME

J. Heat Mass Transfer. August 1989, 111(3): 592–597.

https://doi.org/10.1115/1.3250723

Published Online: August 1, 1989

View Article titled, Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

Topics: Cooling, Cylinders, Temperature, Heat flux, Bonding, Heat, Heat conduction, Heat losses, Heat transfer, Manufacturing

Journal Articles

Continuum Modeling of Low Frequency Heat Conduction in Laminated Composites with Bonds

Adnan H. Nayfeh

Publisher: ASME

J. Heat Mass Transfer. May 1980, 102(2): 312–318.

https://doi.org/10.1115/1.3244280

Published Online: May 1, 1980

View Article titled, Continuum Modeling of Low Frequency Heat Conduction in Laminated Composites with Bonds

Topics: Composite materials, Heat conduction, Modeling, Bonding, Diffusion processes, Thermal diffusion

Journal citation

NARROW

Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”

Heat Transfer Across Nanoparticle–Liquid Interfaces

Investigation on Carbon Nanotubes as Thermal Interface Material Bonded With Liquid Metal Alloy

Fabrication and Experimental Characterization of Nanochannels

Thermal Processing of Tissue Engineering Scaffolds

Equivalent Thermal Resistance of a Corrugated Contact Boundary

Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

Continuum Modeling of Low Frequency Heat Conduction in Laminated Composites with Bonds

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