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Journal Articles

Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes

Enes Tamdogan

J. Heat Transfer. December 2022, 144(12): 122501.

Paper No: HT-22-1080

DOI: https://doi.org/10.1115/1.4055568

Published Online: October 6, 2022

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Topics: Cooling, Junctions, Light-emitting diodes, Particulate matter, Phosphors, Temperature, Coating processes, Coatings

Journal Articles

Transient Response Characteristics and Performance Assessment of a Calorimetric Surface Junction Probe Under Impulsive Thermal Loading

Anil Kumar Rout, Niranjan Sahoo, Pankaj Kalita

J. Heat Transfer. June 2021, 143(6): 062901.

Paper No: HT-20-1113

DOI: https://doi.org/10.1115/1.4050822

Published Online: April 23, 2021

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Topics: Heat flux, Junctions, Probes, Shock tubes, Temperature, Transients (Dynamics), Lasers, Flow (Dynamics), Heat

Includes: Supplementary data

Journal Articles

Electrowetting Induced Droplet Generation in T-Junctions

A. Merdasi, A. Moosavi

J. Heat Transfer. May 2021, 143(5): 052103.

Paper No: HT-20-1741

DOI: https://doi.org/10.1115/1.4049962

Published Online: March 19, 2021

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Topics: Drops, Junctions, Pressure

Journal Articles

Heat Transfer Characteristics of Nonuniform Flow Around a Circular Cylinder in a T-Junction Duct

Xiaoyu Wang, Di Qi, Tong Li, Mei Lin, Hanbing Ke, Min Zeng, Qiuwang Wang

J. Heat Transfer. October 2020, 142(10): 104502.

Paper No: HT-19-1688

DOI: https://doi.org/10.1115/1.4047508

Published Online: July 17, 2020

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Topics: Ducts, Heat transfer, Junctions, Circular cylinders, Cylinders, Separation (Technology), Flow (Dynamics)

Journal Articles

Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”

Jingjie Zhang, Carlos A. Polanco, Avik W. Ghosh

J. Heat Transfer. September 2018, 140(9): 092405.

Paper No: HT-17-1399

DOI: https://doi.org/10.1115/1.4040144

Published Online: May 25, 2018

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Topics: Bonding, Electrical conductance, Junctions, Thermal conductivity, Chain, Simulation, Phonons, Density, Stiffness, Atoms

Journal Articles

Droplet Formation and Fission in Shear-Thinning/Newtonian Multiphase System Using Bilayer Bifurcating Microchannel

Yong Ren, Kai Seng Koh, Jit Kai Chin, Jing Wang, Conghua Wen, Yuying Yan

J. Heat Transfer. January 2018, 140(1): 012405.

Paper No: HT-16-1310

DOI: https://doi.org/10.1115/1.4037338

Published Online: October 4, 2017

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Topics: Drops, Junctions, Microchannels, Nuclear fission, Shear (Mechanics), Flow (Dynamics), Ceramic matrix composites, Fluids

Journal Articles

Convective Heat Transfer and Contact Resistances Effects on Performance of Conventional and Composite Thermoelectric Devices

B. V. K. Reddy, Matthew Barry, John Li, Minking K. Chyu

J. Heat Transfer. October 2014, 136(10): 101401.

Paper No: HT-13-1227

DOI: https://doi.org/10.1115/1.4028021

Published Online: August 5, 2014

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Topics: Composite materials, Convection, Temperature, Boundary-value problems, Junctions, Heat recovery

Journal Articles

A Method for Computing the Analytical Solution of the Steady-State Heat Equation in Multilayered Media

Ivor Dülk, Tamás Kovácsházy

J. Heat Transfer. September 2014, 136(9): 091303.

Paper No: HT-13-1416

DOI: https://doi.org/10.1115/1.4027838

Published Online: June 27, 2014

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Topics: Boundary-value problems, Junctions, Steady state, Temperature, Eigenvalues, Computation, Heat

Journal Articles

Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate

Liang Chen, Satish Kumar

J. Heat Transfer. May 2014, 136(5): 052401.

Paper No: HT-12-1637

DOI: https://doi.org/10.1115/1.4025436

Published Online: March 6, 2014

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Topics: Carbon nanotubes, Junctions, Heat, Energy dissipation, Phonons, Temperature

Journal Articles

Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements

Rakesh Kumar, Niranjan Sahoo

J. Heat Transfer. December 2013, 135(12): 124502.

Paper No: HT-12-1258

DOI: https://doi.org/10.1115/1.4024593

Published Online: September 27, 2013

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Topics: Calibration, Temperature, Thermocouples, Transients (Dynamics), Lasers, Heat conduction, Heat flux, Heat, Sensors, Junctions

Journal Articles

Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

Tengfei Luo, John R. Lloyd

J. Heat Transfer. March 2010, 132(3): 032401.

DOI: https://doi.org/10.1115/1.4000047

Published Online: December 22, 2009

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Topics: Electrical conductance, Junctions, Simulation, Thermal conductivity, Equilibrium (Physics), Atoms, Chain, Temperature, Thermal energy transport, Vibration

Journal Articles

Development of a Transparent Heater to Measure Surface Temperature Fluctuations Under Spray Cooling Conditions

A. R. Griffin, A. Vijayakumar, R.-H. Chen, K. B. Sundaram, L. C. Chow

J. Heat Transfer. November 2008, 130(11): 114501.

DOI: https://doi.org/10.1115/1.2952761

Published Online: August 28, 2008

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Topics: Bubbles, Cooling, Fluctuations (Physics), Junctions, Pool boiling, Sprays, Temperature, Thermocouples, Thin films, Transparency

Journal Articles

Measurements of Three-Dimensional Flow in Microchannel With Complex Shape by Micro-Digital-Holographic Particle-Tracking Velocimetry

Shin-ichi Satake, Takafumi Anraku, Hiroyuki Kanamori, Tomoaki Kunugi, Kazuho Sato, Tomoyoshi Ito

J. Heat Transfer. April 2008, 130(4): 042413.

DOI: https://doi.org/10.1115/1.2818783

Published Online: March 21, 2008

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Topics: Flow (Dynamics), Microchannels, Particulate matter, Junctions, Holography, Shapes

Journal Articles

Impact of Interface Resistance on Pulsed Thermoelectric Cooling

Y. Sungtaek Ju

J. Heat Transfer. January 2008, 130(1): 014502.

DOI: https://doi.org/10.1115/1.2780186

Published Online: January 28, 2008

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Topics: Cooling, Junctions, Temperature, Thermoelectric cooling, Computer simulation, Energy harvesting, Heating, Joules, Steady state, Heat

Journal Articles

Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling

Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Masataka Mochizuki

J. Heat Transfer. October 2007, 129(10): 1445–1452.

DOI: https://doi.org/10.1115/1.2754945

Published Online: February 9, 2007

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Topics: Computer cooling, Condensers (steam plant), Cooling, Design, Fluids, Heat, Heat pipes, Stress, Temperature, Thermal resistance

Journal Articles

The Compatibility of Thin Films and Nanostructures in Thermoelectric Cooling Systems

Andrew Miner

J. Heat Transfer. July 2007, 129(7): 805–812.

DOI: https://doi.org/10.1115/1.2717941

Published Online: September 11, 2006

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Topics: Cooling, Heat, Temperature, Thermal conductivity, Thermoelectric coolers, Thermoelectric cooling, Thin films, Nanowires, Junctions, Systems theory

Journal Articles

Nanoscale Heat Conduction Across Metal-Dielectric Interfaces

Y. “Sungtaek” Ju, Ming-Tsung Hung, Takane Usui

J. Heat Transfer. September 2006, 128(9): 919–925.

DOI: https://doi.org/10.1115/1.2241839

Published Online: March 1, 2006

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Topics: Electrons, Heat conduction, Junctions, Metals, Phonons, Temperature, Thermal resistance, Nanoscale phenomena, Thermal conductivity, Electrodes

Journal Articles

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Lan Tang, Yogendra K. Joshi

J. Heat Transfer. January 2005, 127(1): 18–26.

DOI: https://doi.org/10.1115/1.1852495

Published Online: February 15, 2005

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Topics: Flow (Dynamics), Forced convection, Heat, Heat conduction, Junctions, Mixed convection, Modeling, Printed circuit boards, Temperature, Thermal analysis

Journal Articles

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

Jae-Mo Koo, Sungjun Im, Linan Jiang, Kenneth E. Goodson

J. Heat Transfer. January 2005, 127(1): 49–58.

DOI: https://doi.org/10.1115/1.1839582

Published Online: February 15, 2005

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Topics: Circuits, Convection, Cooling, Heat sinks, Microchannels, Temperature, Thermal resistance, Heat, Boiling, Flow (Dynamics)

Journal Articles

A Dual-Scale Computational Method for Correcting Surface Temperature Measurement Errors

T. C. Tszeng, G. F. Zhou

J. Heat Transfer. August 2004, 126(4): 535–539.

DOI: https://doi.org/10.1115/1.1773585

Published Online: April 20, 2004

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Topics: Computational methods, Errors, Junctions, Temperature, Thermocouples, Wire, Temperature measurement, Finite element methods, Finite element model

Journal citation

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Supplemental Material

Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes

Transient Response Characteristics and Performance Assessment of a Calorimetric Surface Junction Probe Under Impulsive Thermal Loading

Electrowetting Induced Droplet Generation in T-Junctions

Heat Transfer Characteristics of Nonuniform Flow Around a Circular Cylinder in a T-Junction Duct

Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”

Droplet Formation and Fission in Shear-Thinning/Newtonian Multiphase System Using Bilayer Bifurcating Microchannel

Convective Heat Transfer and Contact Resistances Effects on Performance of Conventional and Composite Thermoelectric Devices

A Method for Computing the Analytical Solution of the Steady-State Heat Equation in Multilayered Media

Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate

Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements

Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

Development of a Transparent Heater to Measure Surface Temperature Fluctuations Under Spray Cooling Conditions

Measurements of Three-Dimensional Flow in Microchannel With Complex Shape by Micro-Digital-Holographic Particle-Tracking Velocimetry

Impact of Interface Resistance on Pulsed Thermoelectric Cooling

Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling

The Compatibility of Thin Films and Nanostructures in Thermoelectric Cooling Systems

Nanoscale Heat Conduction Across Metal-Dielectric Interfaces

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

A Dual-Scale Computational Method for Correcting Surface Temperature Measurement Errors

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