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Keywords: 3D IC
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 102901.
Paper No: HT-21-1059
Published Online: September 8, 2021
... of the high-conductivity material between the inner and outer rings is found. The results show that for the optimal conditions, the maximum temperature of the 3D IC is reduced up to 10%; while at the same time, the size of the heat sink and heat spreader can be diminished by as much as 200%. e...
