Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-3 of 3
Keywords: Devices
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2006, 128(7): 638–647.
Published Online: December 21, 2005
...S. Sinha; E. Pop; R.
W. Dutton; K.
E. Goodson Intense electron-phonon scattering near the peak electric field in a semiconductor device results in nanometer-scale phonon hotspots. Past studies have argued that ballistic phonon transport near such hotspots serves to restrict heat conduction. We...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2002, 124(2): 383–390.
Published Online: August 21, 2001
... packaging Boiling Devices Enhancement Finned Surfaces Heat Transfer Roughness Direct liquid cooling by use of dielectric liquids has been considered as one of the promising cooling schemes for high-powered electronic components. Since 1970s, active studies have been conducted in this area...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1999, 121(1): 102–109.
Published Online: February 1, 1999
... 12 2007 Devices Heat Pipes Thin Films Two-Phase Vaporization Cao Y. , Beam J. E. , and Donovan B. , 1996 , “ Air-Cooling System for Metal Oxide Semiconductor Controlled Thyristors Employing Miniature Heat Pipes ,” Journal of Thermophysics and Heat Transfer , Vol...
Topics:
Heat pipes