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1-6 of 6
Keywords: Liquid Cooling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2022, 144(7): 072502.
Paper No: HT-21-1651
Published Online: May 11, 2022
... changes. e-mail: dcmoreira@usp.br e-mail: ribatski@sc.usp.br 1 Corresponding author. e-mail: sgkeme@rit.edu 28 09 2021 09 04 2022 11 05 2022 liquid cooling microchannel developing flow The development of novel electronic devices with high processing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2010, 132(5): 051401.
Published Online: March 8, 2010
...R. Wälchli; T. Brunschwiler; B. Michel; D. Poulikakos A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow loop absorbs heat using mesh-type microchannel...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. December 2008, 130(12): 124501.
Published Online: September 17, 2008
... number ( Re < 1000 ) flow in arrays of conventional intermediate pin-fins ( 0.5 ≤ H fin / d ≤ 8 ) ( 8 9 ) and long pin-fins ( H fin / d > 8 ) ( 10 11 12 ) with diameters several millimeters and larger. Liquid cooled micro-pin...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2008, 130(12): 122402.
Published Online: September 17, 2008
... throughout the entire Nu ave , exp range. coolants cooling heat sinks microfluidics micro-pin-fins heat sink liquid cooling single phase heat transfer Breakthrough in many cutting-edge technologies is increasingly dependent on the availability of highly efficient...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1432–1444.
Published Online: February 23, 2007
...Xiaojin Wei; Yogendra Joshi; Michael K. Patterson One of the promising liquid cooling techniques for microelectronics is attaching a microchannel heat sink to, or directly fabricating microchannels on, the inactive side of the chip. A stacked microchannel heat sink integrates many layers...
Journal Articles
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 59–65.
Published Online: February 15, 2005
... samples compared to theory Although a relatively small set of samples were characterized, some definite conclusions can be stated as follows: 1 Liquid-cooled SiC heat sinks easily outperform air-cooled heat sinks and compare favorable with copper equivalents at similar overall flow rates...