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Keywords: Thermal Packaging
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Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 2010, 132(5): 051401.
Published Online: March 8, 2010
... cooling fluid oscillations heat transfer hydraulic systems microchannel flow microchannel plates micropumps microchannel liquid cooling thermal packaging oscillating flow With the continuous increase in power dissipation and advances in packaging technology of electronics equipment...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. June 2002, 124(3): 405–412.
Published Online: May 10, 2002
...), seldom, if ever, provide the improvement in conductance attainable with metallic coatings. Hence, metallic coatings often afford the best solution. Thermal Contact Conductance Electronic Equipment Thermal Packaging electric admittance metals coatings...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1999, 121(1): 43–49.
Published Online: February 1, 1999
... Nov 1996 16 Jan 1998 05 12 2007 Computer Codes Jets Modeling and Scaling Thermal Packaging Turbulence Baughn, J., Mesbah, M., and Yan, X., 1993, “Measurements of local heat transfer for an impinging jet on a cylindrical pedestal,” ASME HTD-Vol. 239, pp. 57–62. Baughn...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1997, 119(4): 684–690.
Published Online: November 1, 1997
...) and roughness (0.1 to 10 μm). 08 February 1996 16 April 1997 05 12 2007 Conduction Direct-Contact Heat Transfer Thermal Packaging Clausing A. M. , and Chao B. T. , 1965 , “ Thermal Contact Resistance in a Vacuum Environment ,” ASME JOURNAL OF HEAT TRANSFER , Vol. 87...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1997, 119(3): 401–405.
Published Online: August 1, 1997
...; revision received April 11, 1997; Keywords: Conduction; Measurement Techniques; Thermal Packaging. Associate Technical Editor: A. S. Lavine. T\ sinh ji(L x) + T2 sinh fix sinh fjL (1) fj, is a measure of the importance of surface loss relative to bulk conduction, Journal of Heat Transfer AUGUST 1997, Vol...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1997, 119(2): 220–229.
Published Online: May 1, 1997
... conductivities. This suggestion opens new possibilities in the search of high efficiency thermoelectric materials. 28 August 1995 20 December 1996 05 12 2007 Conduction Thermal Packaging Thermophysical Properties Adachi, S., ed., 1993, Properties of Aluminum Gallium Arsenide...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. February 1997, 119(1): 177–180.
Published Online: February 1, 1997
...; revision received October 17, 1996; Keywords: Conduction, Electronic Equipment, Thermal Packaging. Associate Technical Editor: K. Vafai. k = = thermal conductivity <7 = heat flux
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1996, 118(3): 606–615.
Published Online: August 1, 1996
.... The average Nusselt number is determined and correlated in terms of relevant nondimensional parameters for pure forced and mixed convection, respectively. 24 February 1995 29 March 1996 05 12 2007 Flow Visualization Mixed Convection Thermal Packaging Aung, W., 1987, “Mixed...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1996, 118(3): 539–545.
Published Online: August 1, 1996
... is discussed. 11 August 1995 28 March 1996 05 12 2007 Conduction Thermal Packaging Thermophysical Properties Anisimov S. I. , Kapeliovich B. L. , and Perel’man T. L. , 1974 , “ Electron Emission From Metal Surface Exposed to Ultrashort Laser Pulses ,” Soviet...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. February 1996, 118(1): 202–205.
Published Online: February 1, 1996
... OF ME- CHANICAL ENGINEERS. Manuscript received by the Heat Transfer Division May 1994; revision received November 1994. Keywords: Conduction, Electronic Equipment, Thermal Packaging. Associate Technical Editor: L. S. Fletcher. 202 / Vol. 118, FEBRUARY 1996 Transact ions of the ASME Copyright © 1996...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1995, 117(2): 270–275.
Published Online: May 1, 1995
... 05 12 2007 Conduction Electronic Equipment Thermal Packaging Al-Astrabadi, F. R., O’Callaghan, P. W., and Probert, S. D., 1980, “Thermal Resistance of Contacts: Influence of Oxide Films,” AIAA Paper No. 80-1467. Antonetti V. W. , and Yovanovich M. M. , 1985...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. May 1995, 117(2): 508–510.
Published Online: May 1, 1995
...K. C. Chung; H. K. Benson; J. W. Sheffield 01 September 1993 01 August 1994 05 12 2007 Conduction Thermal Packaging Chung, K. C., 1992, “Thermal Contact Conductance of a Phase-Mixed Coating Layer by Transitional Buffering Interface,” Ph.D. Dissertation, Department...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1994, 116(4): 823–828.
Published Online: November 1, 1994
... received by the Heat Transfer Division July 1992; revision received October 1993. Keywords: Conduction, Electronic Equipment, Thermal Packaging. Associate Technical Editor: R. Viskanta. Pressure Distribution. Most of the theoretical and exper- imental studies of bolted joints have been conducted...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1994, 116(3): 604–613.
Published Online: August 1, 1994
... transfer characteristics of an external surface. Materials Processing and Manufacturing Processes Porous Media Thermal Packaging 01 September 1992 01 August 1993 23 05 2008 K. Vafai Professor. Fellow ASME P. C. Huang Department of Mechanical Engineering, The Ohio State...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1994, 116(2): 296–301.
Published Online: May 1, 1994
... November 1992 01 August 1993 23 05 2008 Augmentation and Enhancement Conduction Thermal Packaging S. Hingorani Graduate Student. C. J. Fahrner Graduate Student. D. W. Mackowski Assistant Professor. J. S. Gooding Professor and Head. Mem. ASME Mechanical Engineering Department, Auburn...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1993, 115(4): 973–985.
Published Online: November 1, 1993
... Phenomena Thermal Packaging C O . Gersey Graduate Student. I. Mudawar Professor and Director. Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907 Orientation Effects on Critical Heat Flux From Discrete, In-Line Heat Sources in a Flow...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1993, 115(3): 533–540.
Published Online: August 1, 1993
..., and nitrogen, were employed as the interstitial gas. The comparison between the theory and the measured values of gap conductance shows excellent agreement. 01 April 1992 01 February 1993 23 05 2008 Conduction Electronic Equipment Thermal Packaging S. Song International Business...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1992, 114(4): 802–810.
Published Online: November 1, 1992
.... Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division November 1991; revision received May 1992. Keywords: Conduction, Thermal Packaging. Associate Technical Editor: L. S. Fletcher. Previous investigations have found...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. August 1992, 114(3): 777–780.
Published Online: August 1, 1992
..., Beijing 100084, Peo- ple's Republic of China. Contributed by the Heat Transfer Division of the THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS. Manuscript received by the Heat Transfer Division November 1990; revision received December 1991. Keywords: Natural Convec- tion, Radiation, Thermal Packaging. AA...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1991, 113(1): 56–62.
Published Online: February 1, 1991
... Convection Thermal Packaging A. M. Anderson1 R. J. Moffat Department of Mechanical Engineering, Stanford University, Stanford, CA 94305 Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing This paper discusses forced convection heat transfer...