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Keywords: deformation
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. November 2005, 127(11): 1269–1275.
Published Online: June 9, 2005
.... Thermal contact resistance during the first few milliseconds of impact was obtained by matching measured surface temperature variation with an analytical solution of the one-dimensional transient heat conduction equation. An analytical model of the deformation of a free liquid surface in contact...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2005, 127(9): 1005–1014.
Published Online: April 25, 2005
... behavior and geometry of the melt pool in the laser material interaction process. The evolution of the melt pool and effects of the process parameters are investigated through the simulations with stationary and moving laser beam cases. The roles of the convection and surface deformation on the heat...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2002, 124(2): 284–292.
Published Online: September 4, 2001
...D. Y. Tzou, James C. Dowell Professor, Fellow ASME; J. E. Beraun; J. K. Chen The hot-electron blasting model is extended in this work to describe the ultrafast deformation in thin metal films during the sub-picosecond to picosecond domain. The driving force exerting on the cold metal lattices...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. December 2001, 123(6): 1173–1180.
Published Online: February 1, 2001
... thermal stresses stress analysis deformation glass thermal stress cracking Finite Element Heat Transfer Modeling Numerical Methods Stress Building materials and components are often exposed to thermal stress; in the long run it could be harmful. Effects on fragile materials...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2001, 123(2): 205–212.
Published Online: July 12, 2000
...S. L. Lee, Professor, Mem. ASME; C. R. Ou In this paper, the integration scheme is employed to solve a coupling problem of transient heat conduction and displacement due to thermal deformation. Based on the resulting displacement, gap or contact pressure on the interface of two thermoelastic bodies...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. February 2000, 122(1): 107–112.
Published Online: September 1, 1999
...S. C. Chen; D. G. Cahill; C. P. Grigoropoulos The nanosecond pulsed laser-induced transient melting and miniature surface deformation of Ni-P hard disk substrates has been investigated experimentally. A photothermal displacement method has been developed to detect the transient melting and surface...