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Keywords: electronics packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. January 2009, 131(1): 011603.
Published Online: October 22, 2008
... describes a new test method, which, in conjunction with an older well established type of test, allows all three parameters to be measured using one specimen. 30 10 2007 13 06 2008 22 10 2008 convection cooling electronics packaging foams graphite heat conduction heat exchangers...
Journal Articles
Publisher: ASME
Article Type: Technical Notes
J. Heat Mass Transfer. December 2004, 126(6): 1044–1047.
Published Online: January 26, 2005
.... Electron. Packag. , 114 , pp. 35 – 40 . Nigen , J. S. , and Amon , C. H. , 1993 , “ Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows ,” ASME J. Electron. Packag. , 115 , pp. 356 – 365 . Nigen , J. S. , and Amon...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2004, 126(3): 463–470.
Published Online: June 16, 2004
... February 25, 2004. Associate Editor: C. Amon. 16 May 2003 25 February 2004 16 06 2004 forced convection electronics packaging pipe flow laminar flow flow simulation Channel Flow Convection Experimental Heat Transfer Laminar Many studies have been carried out...
