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Keywords: electronics packaging
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Journal Articles
Article Type: Research Papers
J. Heat Transfer. January 2009, 131(1): 011603.
Published Online: October 22, 2008
... 2007 13 06 2008 22 10 2008 convection cooling electronics packaging foams graphite heat conduction heat exchangers heat sinks porous materials porous fins experimental heat transfer metal foam electronics cooling compact heat exchangers Metallic and graphitic...
Journal Articles
Article Type: Technical Notes
J. Heat Transfer. December 2004, 126(6): 1044–1047.
Published Online: January 26, 2005
.... Electron. Packag. , 114 , pp. 35 – 40 . Nigen , J. S. , and Amon , C. H. , 1993 , “ Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows ,” ASME J. Electron. Packag. , 115 , pp. 356 – 365 . Nigen , J. S. , and Amon...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. June 2004, 126(3): 463–470.
Published Online: June 16, 2004
.... Electron. Packag. , 113 , pp. 21 – 26 . Igarashi, T., and Takasaki, H., 1995, “Fluid Flow and Heat Transfer Around a Rectangular Block Fixed on a Flat Plate Laminar Boundary Layer,” Proc. 4th ASME/JSME Thermal Engineering Joint Conf., ASME/JSME, NY/Tokyo, Japan, 1 , pp. 295–302. McEntire...