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Keywords: thermal management
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Journal Articles
Article Type: Research-Article
J. Heat Transfer. December 2022, 144(12): 122501.
Paper No: HT-22-1080
Published Online: October 6, 2022
.... , Arik , M. , and Dogruoz , M. B. , 2013 , “ Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement ,” ASME Paper No. 91-GT-063. 10.1115/91-GT-063 [21] Bar-Cohen , A. , 1993 , “ Thermal Management of Electronic Components With Dielectric Liquids ,” JSME Int. J...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
Published Online: September 8, 2021
...Sevket U. Yuruker; Raphael K. Mandel; Patrick McCluskey; Michael M. Ohadi To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. March 2021, 143(3): 031501.
Paper No: HT-20-1115
Published Online: January 18, 2021
... and pressure drops. In general, as the temperature of the hotspot remains around 70 °C with a heat flux of 625 W/cm 2 , the nonuniform fin-enhanced microgaps appears to be a promising hotspot thermal management approach. The pressure drop of hydrofoil spanwise chip is highest among all the cases. e-mail...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. April 2020, 142(4): 041602.
Paper No: HT-18-1838
Published Online: February 27, 2020
... heat transfer hydrophobic surface phase change thermal management Average temperatures are based on the thermocouple readings at the planes x a and x b . In Figs. 9( a ) and 9( b ) , the deviations of local temperatures are displayed as dimensionless values. In both cases, the trends...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. October 2014, 136(10): 104503.
Paper No: HT-13-1474
Published Online: July 29, 2014
... condition, which is a key engineering quantity that is sought in problems of this class. discrete heat source optimal configuration mixed convection surface radiation thermal management Discrete heat sources are individual heating elements, which are mounted on the computer motherboard...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. January 2014, 136(1): 011301.
Paper No: HT-12-1374
Published Online: October 25, 2013
... and phase-change cooling strategies, this percentage becomes even greater. If the thermal management of an electronic device is inadequate, unacceptable temperature levels may be reached which can adversely affect device performance, reliability, and lifespan [ 7 ]. These thermal issues have spawned...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. January 2014, 136(1): 013001.
Paper No: HT-13-1378
Published Online: October 21, 2013
... computers ubiquitous parts of our society generates diverse computational devices. Concomitant developments in heat generation density and heat transfer paths pose fresh challenges to thermal management. In an introductory part of the paper, I recollect our experiences in the mainframe computers...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. August 2013, 135(8): 081902.
Paper No: HT-12-1384
Published Online: July 18, 2013
... to increase by up to 46%. As the cost of access to space is significant, this reduction in mass could lead to savings for spacecraft thermal management applications. extended surface heat transfer fin thermal radiation thermal management fractal References [1] Gilmore , D. G. , ed...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. August 2013, 135(8): 082701.
Paper No: HT-12-1398
Published Online: July 18, 2013
... bifurcation angles. As expected, base temperatures were highest for the largest width-to-thickness ratios and smallest for materials with relatively higher thermal conductivities. thermal radiation fins computational thermal management extended surfaces heat transfer It is critically...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. May 2013, 135(5): 054503.
Paper No: HT-12-1231
Published Online: April 11, 2013
... electronics thermal management phase change material liquid metal heat storage electronic cooling Smartphone and PPC have emerged as extremely popular electronic mediums in the last two years with the iPhone and iPad in high demand and the Android Mobile Operating System gradually prevalent...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. April 2013, 135(4): 041901.
Paper No: HT-11-1177
Published Online: March 20, 2013
... of Microscale Fractal-Like Branching Channels ,” ASME J. Heat Transfer , 126 ( 5 ), pp. 744 – 752 . 10.1115/1.1795236 [11] Lee , P. S. , and Garimella , S. V. , 2005 , “ Hot-Spot Thermal Management With Flow Modulation in a Microchannel Heat Sink ,” Proceedings of 2005 ASME International...
Journal Articles
Article Type: Research-Article
J. Heat Transfer. November 2012, 134(11): 112902.
Published Online: September 28, 2012
... to document bubble dynamics. Boiling mechanisms inherent to subcooling, enhanced surface geometry, and CHF are discussed. flow boiling enhanced surface structured-porous subatmospheric pressure high heat flux water nucleation structured-porous surface screen laminate thermal management...
Journal Articles
Article Type: Heat Transfer Enhancement
J. Heat Transfer. October 2012, 134(10): 101901.
Published Online: August 7, 2012
... 08 2012 enhanced microchannel oblique fins thermal management electronic cooling The miniaturization of electronic device coupled with advancement in packaging technology has led to continuous increments in packaging density and associated higher heat fluxes that need...
Journal Articles
Article Type: Electronic Cooling
J. Heat Transfer. June 2012, 134(6): 061401.
Published Online: May 2, 2012
...Man Prakash Gupta; Minki Cho; Saibal Mukhopadhyay; Satish Kumar In this paper, a proactive thermal management technique called “power multiplexing” is explored for many-core processors. Power multiplexing involves redistribution of the locations of active cores at regular time intervals to obtain...
Journal Articles
Article Type: Review Articles
J. Heat Transfer. November 2011, 133(11): 110801.
Published Online: September 2, 2011
...M. A. Ebadian; C. X. Lin In recent years, high-heat-flux cooling techniques have received great attention from researchers around the world due to its importance in thermal management of both commercial and defense high-power electronic devices. Although impressive progress has been made during...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 2011, 133(8): 081401.
Published Online: May 2, 2011
...Wessel W. Wits; Jim B. W. Kok A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB), has been developed, based on mainstream PCB...
Topics: Heat pipes, Heat
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. May 2011, 133(5): 054504.
Published Online: February 2, 2011
...W. Wu; J. H. Du; Y. R. Lin; L. C. Chow; H. Bostanci; B. A. Saarloos; D. P. Rini This study investigates a V-shaped corrugated carbon foam heat sink for thermal management of electronics with forced air convection. Experiments were conducted to determine the heat sink performance in terms of heat...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. April 2011, 133(4): 041501.
Published Online: January 6, 2011
...-9310(80)90140-4 boiling flow through porous media heat transfer laminates water boiling enhanced surface subatmospheric pressure correlation water nucleation structured-porous surface screen laminate thermal management electronic cooling The rapidly increasing use...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. July 2009, 131(7): 071401.
Published Online: May 5, 2009
... 05 2009 ammonia cooling hysteresis indentation sprays surface roughness heat transfer thermal management electronics cooling two-phase enhanced surfaces hysteresis In light of cooling requirements of today’s high heat flux generating devices, spray cooling continues...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. June 2009, 131(6): 064505.
Published Online: April 13, 2009
... . 12 03 2008 13 11 2008 13 04 2009 cooling heat conduction PD control Peltier effect temperature control thermal management (packaging) thermoelectric devices thermo-electric cooling thermal control conduction thermal management Passive thermal control...