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Journal Articles

Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

Hyuck Lee, Hyeonwoo Kim, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070902.
Paper No: MANU-23-1590
https://doi.org/10.1115/1.4065226
Published Online: April 22, 2024
View Article titled, Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels
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Topics: Cams, Image segmentation, Semantics, Semiconductor wafers, Trains
Journal Articles

Flaw Detection in Multi-Laser Powder Bed Fusion Using In Situ Coaxial Multi-Spectral Sensing and Deep Learning

Amit Surana, Matthew E. Lynch, Abdalla R. Nassar, Greg C. Ojard, Brian A. Fisher, David Corbin, Ryan Overdorff
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. May 2023, 145(5): 051005.
Paper No: MANU-22-1330
https://doi.org/10.1115/1.4056540
Published Online: January 19, 2023
View Article titled, Flaw Detection in Multi-Laser Powder Bed Fusion Using In Situ Coaxial Multi-Spectral Sensing and Deep Learning
Open the PDF for Flaw Detection in Multi-Laser Powder Bed Fusion Using In Situ Coaxial Multi-Spectral Sensing and Deep Learning in another window
Topics: Flaw detection, Lasers, Sensors, Image segmentation, Resolution (Optics), Semantics, Time series, Testing