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Journal Articles

Hyperspectral Analysis of Silicon Nanowires Manufactured Through Metal-Assisted Chemical Etching

Pee-Yew Lee, Guo-Hao Lu, Yi-Hong Bai, Cheng-You Chen, Li-Yan Wu, Chun-Jen Weng, Hung Ji Huang, Yung-Sheng Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. February 2025, 147(2): 024501.
Paper No: MANU-24-1424
https://doi.org/10.1115/1.4066546
Published Online: October 14, 2024
View Article titled, Hyperspectral Analysis of Silicon Nanowires Manufactured Through Metal-Assisted Chemical Etching
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Topics: Chemical etching, Etching, Imaging, Metals, Nanowires, Reflection, Semiconductor wafers, Silicon, Wavelength, Resonance
Journal Articles

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Kuan Lu, Zhikun Wang, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070908.
Paper No: MANU-23-1366
https://doi.org/10.1115/1.4065639
Published Online: June 10, 2024
View Article titled, Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis
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Topics: Diffraction patterns, Imaging, Inspection, Metrology, Semiconductor wafers, Feature extraction, Particulate matter
Journal Articles

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Fengfeng Zhou, Xingyu Fu, Siying Chen, Changheon Han, Martin B. G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070907.
Paper No: MANU-23-1611
https://doi.org/10.1115/1.4065523
Published Online: June 3, 2024
View Article titled, Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies
Open the PDF for Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies in another window
Topics: Fibers, Flaw detection, Interferometers, Semiconductor wafers, Leakage, Optical fiber, Refractive index, Wavelength
Journal Articles

Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

Hongyi Xiang, Haoxiang Wang, Renke Kang, Shang Gao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 071007.
Paper No: MANU-23-1619
https://doi.org/10.1115/1.4065455
Published Online: May 23, 2024
View Article titled, Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal
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Topics: Brittleness, Grinding, Semiconductor wafers, Silicon carbide, Surface roughness, Cutting, Grinding wheels
Journal Articles

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070906.
Paper No: MANU-23-1591
https://doi.org/10.1115/1.4065276
Published Online: May 9, 2024
View Article titled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
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Topics: Resolution (Optics), Semiconductor wafers, Inspection
Journal Articles

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Shu-Kai S. Fan, Pei-Chen Chen, Chih-Hung Jen, Kanchana Sethanan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070904.
Paper No: MANU-23-1598
https://doi.org/10.1115/1.4065118
Published Online: April 22, 2024
View Article titled, Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing
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Topics: Semiconductor wafers, Integrated circuit fabrication
Journal Articles

Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

Hyuck Lee, Hyeonwoo Kim, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070902.
Paper No: MANU-23-1590
https://doi.org/10.1115/1.4065226
Published Online: April 22, 2024
View Article titled, Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels
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Topics: Cams, Image segmentation, Semantics, Semiconductor wafers, Trains
Journal Articles

Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning

Hyeonwoo Kim, Heegeon Yoon, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070903.
Paper No: MANU-23-1525
https://doi.org/10.1115/1.4065255
Published Online: April 22, 2024
View Article titled, Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning
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Topics: Semiconductor wafers, Trains, Feature extraction, Algorithms, Ablation (Vaporization technology)
Journal Articles

Effects of Antifoaming Agents on Manufacturing Silver Dendrites Through Fluoride-Assisted Galvanic Replacement Reaction

Pee-Yew Lee, Chen-Yu Li, Yi-Hong Bai, Hung Ji Huang, Chun-Jen Weng, Yung-Sheng Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. June 2024, 146(6): 064502.
Paper No: MANU-24-1086
https://doi.org/10.1115/1.4065277
Published Online: April 22, 2024
View Article titled, Effects of Antifoaming Agents on Manufacturing Silver Dendrites Through Fluoride-Assisted Galvanic Replacement Reaction
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Topics: Bubbles, Ethanol, Hydrogen, Manufacturing, Silver, Semiconductor wafers, Ions
Journal Articles

Effects of Bubbles on Manufacturing Gold Dendrites and Silicon Nanowires Through the Fluoride-Assisted Galvanic Replacement Reaction

Pee-Yew Lee, Hung Ji Huang, Tsung-Shine Ko, Ying-Lun Hung, Li-Yan Wu, Jia-Jun Fan, Yung-Sheng Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. November 2023, 145(11): 114501.
Paper No: MANU-23-1284
https://doi.org/10.1115/1.4062878
Published Online: July 21, 2023
View Article titled, Effects of Bubbles on Manufacturing Gold Dendrites and Silicon Nanowires Through the Fluoride-Assisted Galvanic Replacement Reaction
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Topics: Bubbles, Manufacturing, Metals, Nanowires, Silicon, Vacuum, Semiconductor wafers, Chemical etching, Etching
Journal Articles

Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching

Pee-Yew Lee, Chun-Jen Weng, Hung Ji Huang, Li-Yan Wu, Guo-Hao Lu, Chao-Feng Liu, Cheng-You Chen, Ting-Yu Li, Yung-Sheng Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. September 2023, 145(9): 094501.
Paper No: MANU-23-1086
https://doi.org/10.1115/1.4062392
Published Online: May 9, 2023
View Article titled, Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching
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Topics: Bubbles, Chemical etching, Etching, Hydrogen, Metals, Nanowires, Semiconductor wafers, Manufacturing, Silicon
Journal Articles

Optical Metrology of Critical Dimensions in Large-Area Nanostructure Arrays With Complex Patterns

Ramin Sabbagh, Alec Stothert, S. V. Sreenivasan, Dragan Djurdjanovic
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2023, 145(6): 061010.
Paper No: MANU-22-1619
https://doi.org/10.1115/1.4056923
Published Online: March 14, 2023
View Article titled, Optical Metrology of Critical Dimensions in Large-Area Nanostructure Arrays With Complex Patterns
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Topics: Dimensions, Gages, Inspection, Inverse problems, Metrology, Reflectance, Semiconductor wafers, Spectra (Spectroscopy), Optimization, Simulation
Journal Articles

Precision Silicon Exfoliation Tool Design

Martin J. Ward, Dipankar Behera, Michael A. Cullinan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. February 2023, 145(2): 024501.
Paper No: MANU-22-1105
https://doi.org/10.1115/1.4055320
Published Online: September 27, 2022
View Article titled, Precision Silicon Exfoliation Tool Design
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Topics: Design, Metrology, Semiconductor wafers, Silicon, Stress, Surface roughness, Errors, Nickel, Film thickness, Engineering prototypes
Journal Articles

Study on Controllable Thickness and Flatness of Wafer-Scale Nickel Shim in Precision Electroforming Process: Simulation and Validation

Honggang Zhang, Nan Zhang, Fengzhou Fang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. November 2021, 143(11): 111005.
Paper No: MANU-20-1688
https://doi.org/10.1115/1.4051006
Published Online: June 11, 2021
View Article titled, Study on Controllable Thickness and Flatness of Wafer-Scale Nickel Shim in Precision Electroforming Process: Simulation and Validation
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Topics: Current density, Electroforming, Nickel, Semiconductor wafers, Electrodeposition
Journal Articles

Influence of Precursor Concentration on Crystalline Quality of GaN Thin Films Grown on a Sapphire Wafer

Omar Dhannoon Jumaah, Yogesh Jaluria
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. November 2021, 143(11): 111001.
Paper No: MANU-21-1071
https://doi.org/10.1115/1.4050825
Published Online: May 7, 2021
View Article titled, Influence of Precursor Concentration on Crystalline Quality of GaN Thin Films Grown on a Sapphire Wafer
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Topics: Gallium nitride, Thin films, Semiconductor wafers, Sapphire, Metalorganic chemical vapor deposition, Atomic force microscopy, Dislocation density
Journal Articles

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. May 2021, 143(5): 051006.
Paper No: MANU-20-1189
https://doi.org/10.1115/1.4048637
Published Online: November 11, 2020
View Article titled, Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition
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Topics: Oscillations, Vibration, Wire, Semiconductor wafers, Slurries, Abrasive machining, Boundary-value problems
Journal Articles

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

Jingfei Yin, Qian Bai, Bi Zhang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. October 2019, 141(10): 101012.
Paper No: MANU-18-1639
https://doi.org/10.1115/1.4044417
Published Online: September 4, 2019
View Article titled, Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering
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Topics: Damage, Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics), Semiconductor wafers, Stress, Grinding
Journal Articles

Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning

Zhixiong Li, Dazhong Wu, Tianyu Yu
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. March 2019, 141(3): 031003.
Paper No: MANU-18-1189
https://doi.org/10.1115/1.4042051
Published Online: January 17, 2019
View Article titled, Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning
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Topics: Algorithms, Modeling, Semiconductor wafers, Feature extraction, Physics
Journal Articles

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Bin Lin, Ping Zhou, Ziguang Wang, Ying Yan, Renke Kang, Dongming Guo
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2018, 140(12): 121001.
Paper No: MANU-18-1118
https://doi.org/10.1115/1.4041245
Published Online: September 17, 2018
View Article titled, Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
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Topics: Cutting, Grinding, Grinding wheels, Semiconductor wafers, Surface roughness
Journal Articles

Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining

Kamlesh Joshi, Upendra Bhandarkar, Indradev Samajdar, Suhas S. Joshi
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. September 2018, 140(9): 091001.
Paper No: MANU-17-1751
https://doi.org/10.1115/1.4039647
Published Online: June 4, 2018
View Article titled, Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining
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Topics: Damage, Semiconductor wafers, Wire, Electrical discharge machining