...Song Yuan; Xiaoguang Guo; Hao Wang; Shang Gao Diamond has attracted extensive attention from many scholars due to its characteristics, whereas the high-efficiency and ultra-low damage machining regarding diamond is still a bottleneck restricting its applications. Herein, a new polishing equipment...

... simulation has been carried out to analyze the process behavior and its effects on abrasive particles. After simulation, it is observed that the finishing force and velocity damage the abrasive particle by changing its phase from diamond cubic to graphite. Thus, the abrasive particles need replacement...

...Jiaqing Wu; Weilong Cong; Robert E. Williams; Z. J. Pei Rotary ultrasonic machining (RUM) is a hybrid machining approach that combines two material removal mechanisms, namely, diamond grinding and ultrasonic machining. This paper presents the results of dynamic process modeling for RUM of alumina...

...JiAn Duan; DeFu Liu The purpose of this paper is to reveal material removal mechanisms of optical fiber end-surface in lapping processes. The lapping process experiments are conducted using fixed diamond abrasive lapping films with various particle sizes of 6 μ m , 3 μ m , 1 μ m , and 0.5 μ m...

... report the design and implementation of this new system. Experimental results demonstrate the effectiveness of the system and show that the microplasma can be used in various applications including localized etching of silicon and diamond and localized patterning of photoresist. 16 06 2009 04...

...Chun-Hsi Su; Chii-Ruey Lin; Guo-Tsai Liau; Ching-Yu Chang Microwave plasma jet chemical vapor deposition is used to grow array types of carbon nanotubes and diamond films on silicon substrates. In this study, we report a patterned growth of carbon nanotubes and diamond films using the barrier layer...

...Stefan Rakuff; Paul Beaudet Diamond turning of microstructures on the surface of large cylindrical workpieces has become important with advances made in roll-to-roll manufacturing processes of optical films, drag reduction films, microfluidic devices, and organic electronic components...

...M. B. Cai; X. P. Li; M. Rahman In nanoscale ductile mode cutting of the monocrystalline silicon wafer, micro-, or nanogrooves on the diamond cutting tool flank face are often observed, which is beyond the understanding based on conventional cutting processes because the silicon workpiece material...

... by the Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING . Manuscript received April 5, 2002; revised March 6, 2004. Associate Editor: M. Davies. boron compounds diamond cutting tools cutting wear testing machining wear surface roughness...

...Masahiko Yoshino; Sivanandam Aravindan This paper reports on nanosurface fabrication of hard brittle materials by structured diamond tool imprinting. Ultrafine structured surfaces were fabricated on soda glass, firelite glass, quartz glass, quartz wafer, and silicon. A specially designed...

...J. M. Rodrı´guez Lelis; J. Colı´n Ocempo; J. Porcayo Caldero´n; J. M. Robles In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns...

...Diwakar Ramanathan; Pal A. Molian A 200-fs pulsed Ti:Sapphire laser was used to micromachine Type IIa single crystal diamond. The effects of pulse energy and exposure time were investigated. Both blind and through holes were generated by trepanning and percussion modes. Trenches were produced...

...Albert J. Shih A new regulating wheel truing method for through-feed centerless grinding is presented. In conventional regulating wheel truing systems, a single-point diamond tool is traversed across the regulating wheel in a straight line. The interference between the regulating wheel...

... with longer contact lengths. For sawing, the normal force per grain was nearly proportional to the calculated undeformed chip thickness. The G -ratios at different sawing rates reached a maximum value at the same intermediate undeformed chip thickness, which was attributed to a transition in the diamond wear...

...T. W. Hwang; C. J. Evans; S. Malkin, Distinguished Professor, Fellow of ASME This is the second in a series of two papers concerned with high speed grinding of silicon nitride with electroplated diamond wheels. In the first article (ASME J. Manuf. Sci. Eng., 122 , pp. 32–41), it was shown...

...T. W. Hwang; C. J. Evans; E. P. Whitenton; S. Malkin, Distinguished Professor, Fellow of ASME, An investigation is reported on high speed grinding of silicon nitride using electroplated single-layer diamond wheels. This article is concerned with wheel wear and wheel life, and a second paper (ASME J...