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Journal Articles

Nondestructive Photoelastic and Machine Learning Characterization of Surface Cracks and Prediction of Weibull Parameters for Photovoltaic Silicon Wafers

Logan P. Rowe, Alexander J. Kaczkowski, Tung-Wei Lin, Gavin P. Horn, Harley T. Johnson
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2022, 144(3): 031001.
Paper No: MATS-20-1043
https://doi.org/10.1115/1.4052673
Published Online: January 12, 2022
View Article titled, Nondestructive Photoelastic and Machine Learning Characterization of Surface Cracks and Prediction of Weibull Parameters for Photovoltaic Silicon Wafers
Open the PDF for Nondestructive Photoelastic and Machine Learning Characterization of Surface Cracks and Prediction of Weibull Parameters for Photovoltaic Silicon Wafers in another window
Topics: Fracture (Materials), Semiconductor wafers, Stress, Microcracks, Surface cracks
Journal Articles

Surface Quality and Contamination on Si Wafer Surfaces Sliced Using Wire-Electrical Discharge Machining

Kamlesh Joshi, Pradeep Padhamnath, Upendra Bhandarkar, Suhas S. Joshi
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2019, 141(4): 041013.
Paper No: MATS-19-1001
https://doi.org/10.1115/1.4044374
Published Online: September 7, 2019
View Article titled, Surface Quality and Contamination on Si Wafer Surfaces Sliced Using Wire-Electrical Discharge Machining
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Topics: Contamination, Damage, Semiconductor wafers, Wire, Servomechanisms
Journal Articles

Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

Hao Wu, Shreyes N. Melkote
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2012, 134(4): 041011.
https://doi.org/10.1115/1.4006177
Published Online: September 4, 2012
View Article titled, Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
Open the PDF for Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers in another window
Topics: Brittleness, Cutting, Diamonds, Fracture (Materials), Friction, Sawing, Shapes, Silicon, Stress, Wire