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Proceedings Papers

Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

Anand Desai, James Geer, Bahgat Sammakia

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 617-623, July 8–12, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2007-33045

https://doi.org/10.1115/IPACK2007-33045

View Paper titled, Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

Topics: Boundary-value problems, Computer simulation, Heat conduction, Steady state, Temperature, Temperature distribution

Proceedings Papers

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Anand Desai, James Geer, Bahgat Sammakia

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-431, November 5–11, 2005

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2005-79732

https://doi.org/10.1115/IMECE2005-79732

View Paper titled, Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Topics: Carbon, Carbon nanotubes, Cylinders, Electrical measurement, Energy dissipation, Flat heat pipes, Geometry, Heat conduction, Heat sinks, Modeling

Proceedings Papers

Heat Conduction in Three Dimensional Stacked Packages

Anand Desai, James Geer, Bahgat Sammakia

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 467-472, November 5–11, 2005

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2005-79771

https://doi.org/10.1115/IMECE2005-79771

View Paper titled, Heat Conduction in Three Dimensional Stacked Packages

Topics: Heat conduction, Thermal management, Geometry, Heat, Carbon nanotubes, Cooling, Modeling, Steady state, Thermal conductivity

Journal Articles

Heat Conduction in Multilayered Rectangular Domains

James Geer, Anand Desai, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. December 2007, 129(4): 440–451.

https://doi.org/10.1115/1.2804094

Published Online: April 7, 2007

View Article titled, Heat Conduction in Multilayered Rectangular Domains

Topics: Boundary-value problems, Heat, Heat conduction, Temperature, Thermal management

Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. March 2006, 128(1): 10–17.

https://doi.org/10.1115/1.2159003

Published Online: May 18, 2005

View Article titled, Models of Steady Heat Conduction in Multiple Cylindrical Domains

Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management

Journal Articles

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Anand Desai, Sanket Mahajan, Ganesh Subbarayan, Wayne Jones, James Geer, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. March 2006, 128(1): 92–97.

https://doi.org/10.1115/1.2161231

Published Online: May 10, 2005

View Article titled, A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Topics: Carbon nanotubes, Nanotubes, Temperature, Thermal conductivity, Thermal management

Journal citation

NARROW

Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Heat Conduction in Three Dimensional Stacked Packages

Heat Conduction in Multilayered Rectangular Domains

Models of Steady Heat Conduction in Multiple Cylindrical Domains

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Heat Conduction in Three Dimensional Stacked Packages

Heat Conduction in Multilayered Rectangular Domains

Models of Steady Heat Conduction in Multiple Cylindrical Domains

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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