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1-6 of 6
Burak Ozpineci
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97172
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021103.
Paper No: EP-21-1019
Published Online: September 15, 2021
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2516
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
Published Online: June 26, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6436
Proceedings Papers
Roderick Jackson, Scott Curran, Paul Chambon, Brian Post, Lonnie Love, Robert Wagner, Burak Ozpineci, Madhu Chinthavali, Michael Starke, Johney Green, Jr., Lucas Tryggestad, Brian Lee
Proc. ASME. IMECE2016, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T07A001, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66256